Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
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Field Programmable Gate Arrays (FPGA) XCV100E-6PQG240C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of Logic Cells:
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JESD-30 Code:
JESD-609 Code:
Qualified:
XCV100E-6PQG240C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Kingwell Technonlogy
1N4148
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
Secos
LFXP2-5E-5QN208C
Lattice Semiconductor
LFXP2-5E-5QN208C by Lattice Semiconductor is a 5000 Logic Cells FPGA with 625 CLBs, operating at max 435 MHz clock frequency. It has 146 inputs/outputs, uses CMOS technology, and supports supply voltage of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices or embedded systems.
10CL025ZU256I8G
Intel
Intel's 10CL025ZU256I8G FPGA features 24624 logic cells, 1539 CLBs, and 150 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor.
LCMXO2-640HC-4MG132I
LCMXO2-640HC-4MG132I by Lattice Semiconductor is a FPGA with 640 logic cells, 79 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-performance computing and programmable IC solutions.
XC7S75-1FGGA484I
Xilinx
Xilinx XC7S75-1FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with surface mount technology.
10M02SCM153I7G
Intel 10M02SCM153I7G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of -40°C to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.
XC7S15-2CSGA225I
Xilinx XC7S15-2CSGA225I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Suitable for surface mount designs with a package style of grid array and fine pitch terminals.
XC7S50-2FGGA484C
The Xilinx XC7S50-2FGGA484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
M2GL005-TQG144I
Microchip Technology
M2GL005-TQG144I by Microchip Technology is a Field Programmable Gate Array (FPGA) with a max supply voltage of 1.26V and min operating temperature of -40°C. Its package style is flatpack, low profile, fine pitch making it suitable for industrial applications requiring high performance in compact spaces. With 144 terminals and matte tin finishing, this FPGA offers versatility and reliability in electronic designs.
EP4CE10F17C8N
EP4CE10F17C8N by Intel is a FPGA with 10320 logic cells and 179 inputs/outputs. Operating at a max frequency of 472.5 MHz, it's ideal for applications requiring high-speed processing like telecommunications and signal processing. With a low profile grid array package style, it offers flexibility in design and integration.
EP4CE22E22C8N
EP4CE22E22C8N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design and integration.
EP4CE6F17C7N
Altera
The EP4CE6F17C7N by Altera is a Field Programmable Gate Array (FPGA) with 6272 logic cells, 392 CLBs, and 179 inputs/outputs. It has a maximum clock frequency of 472.5 MHz and operates at a maximum temperature of 85°C. Its compact package size makes it suitable for various applications requiring high-performance programmable ICs.
XC7A100T-1FGG676C
Xilinx XC7A100T-1FGG676C is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. It operates b/w -40 to 85°C and is ideal for high-speed digital applications requiring programmable ICs in a grid array package.
XC7A50T-3CPG236E
Xilinx XC7A50T-3CPG236E is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1412 MHz. Ideal for high-speed applications requiring low power consumption and compact design. Suitable for various industries like telecommunications, automotive, and aerospace due to its advanced features.
XC6SLX25T-2FGG484C
Xilinx XC6SLX25T-2FGG484C FPGA features 24051 logic cells, 1879 CLBs, and 667 MHz max clock frequency. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. Package style: Grid Array, with a max operating temperature of 85°C.
10CL080YU484I7G
Intel's 10CL080YU484I7G FPGA features 5079 CLBs, operates at -40 to 100 °C, with a supply voltage of 1.2V. Ideal for industrial applications requiring high performance and flexibility in a compact GRID ARRAY package with 0.8mm terminal pitch.
M1A3P1000-PQG208M
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
10M08SCU169I7G
Intel's 10M08SCU169I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with ball terminals.
XC6SLX45-3CSG324C
The Xilinx XC6SLX45-3CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at a max frequency of 862 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability under varying operating conditions.
EP4CE40F23C6N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC6SLX25-2FTG256I
Xilinx XC6SLX25-2FTG256I FPGA features 24051 logic cells, 1879 CLBs, and max clock frequency of 667MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile.
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XCV100-4CS144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
XCV100-4PQ240I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE; JESD-609 Code: e0;
XCV1000-6BGG560C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;
XCV1000-4FG680C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE;
XCV1000-5BGG560C
XCV1000-6BG560C
XCV1000-5BG560C
XCV1000-6BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;
XCV1000-4BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; No. of Equivalent Gates: 1124022;
XCV1000-5BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
XCV1000-4FG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;
XCV1000-5FG680C
XCV1000-5FGG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Maximum Clock Frequency: 294 MHz;
XCV1000-4FGG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5);
XCV1000-6BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCV1000-4BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Length: 42.5 mm;
XCV1000-5FG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B680;
XCV1000-5BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XCV1000-4BG560C
XCV1000-4BGG560C
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