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XC7K355T-1FFG901C

Xilinx

XC7K355T-1FFG901C by Xilinx

Xilinx XC7K355T-1FFG901C is a FPGA with 356160 logic cells, 27825 CLBs, and max clock frequency of 1098 MHz. It operates at 0-85°C, has 300 inputs/outputs, and supports voltages of 1V to 3.3V. Ideal for high-performance computing applications requiring fast processing speeds in compact designs.

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$2,569.030

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VNN

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Nova Conductors

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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$89.706

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Aztec Data Supply Inc.

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Argo Parts USA

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$2,451.539

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Microchip USA

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Netroflash

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Advanced Electronics

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Lixinc

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Qasali Group International

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Overview

Unlock the power of cutting-edge technology with the Xilinx XC7K355T-1FFG901C Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA boasts 356160 logic cells and a maximum clock frequency of 1098 MHz, making it perfect for a wide range of applications. From aerospace to telecommunications, this versatile device offers unmatched performance and flexibility. Experience the value and benefits of the XC7K355T-1FFG901C today and take your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this FPGA lightweight and cost-effective.

No. of Logic Cells: 356160

With a high number of logic cells, this FPGA offers extensive capabilities for complex programmable logic designs.

Surface Mount: YES

The surface-mount feature makes this FPGA easy to install and suitable for various applications where space is limited.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage requirement of 1.03 V helps in reducing power consumption and heat dissipation.

No. of CLBs: 27825

The large number of Configurable Logic Blocks (CLBs) allows for flexible and versatile programming options in this FPGA.

Technology Used: CMOS

The use of complementary metal-oxide-semiconductor (CMOS) technology ensures high performance and low power consumption in this FPGA.

No. of Inputs: 300

With 300 input channels, this FPGA can handle a wide range of input signals for diverse applications.

Package Shape: SQUARE

The square package shape provides a compact form factor for easy integration and placement in electronic systems.

Form Of Terminal: BALL

The ball form of terminals facilitates reliable connections and soldering during installation of this FPGA.

Power Supplies (V): 1,1.8,3.3

The availability of multiple power supply options (1V, 1.8V, 3.3V) enhances compatibility with different electrical systems.

No. of Terminals: 901

The high number of terminals allows for robust connectivity and signal routing in this FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC type offers flexibility for dynamic reconfiguration and customization of logic functions.

Package Style (Meter): GRID ARRAY

The grid array package style provides enhanced thermal performance and reliability for this FPGA.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage requirement of 0.97V ensures efficient operation and reliable performance in diverse environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C enables reliable operation in challenging thermal conditions.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch allows for precise and compact layout designs when integrating this FPGA into a system.

Maximum Combinatorial Delay of a CLB: 0.74 ns

The low maximum combinatorial delay of 0.74ns ensures fast signal processing and reduced latency in this FPGA.

Organization: 27825 CLBS

The organizational structure of 27825 CLBs provides a scalable and efficient platform for building complex logic circuits in this FPGA.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable functionality even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals enhances conductivity and solderability for robust connections in this FPGA.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies PCB layout and assembly when incorporating this FPGA into a system.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates moderate sensitivity to moisture, making proper handling and storage crucial for maintaining the integrity of this FPGA.

Maximum Seated Height: 3.35 mm

The low maximum seated height of 3.35mm allows for compact and space-efficient designs with this FPGA.

Width: 31 mm

The 31mm width offers a compact form factor for easy integration and placement in electronic systems.

Maximum Clock Frequency: 1098 MHz

The high maximum clock frequency of 1098MHz enables fast processing speeds and real-time operation in this FPGA.

No. of Outputs: 300

With 300 output channels, this FPGA allows for versatile signal routing and processing capabilities for diverse applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly of this FPGA.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C supports robust solder connections and secure attachment of this FPGA.

Length: 31 mm

The 31mm length provides a compact footprint for efficient integration and space-saving design considerations for this FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K355T-1FFG901C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

356160

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

27825

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

0.74 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

27825 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

31 mm

Width:

31 mm

Maximum Seated Height:

3.35 mm

Package Equivalence Code:

BGA900,30X30,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

901

Standards

JESD-30 Code:

S-PBGA-B901

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K355T-1FFG901C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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