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XC6SLX150T-3FG676I

Xilinx

XC6SLX150T-3FG676I by Xilinx

Xilinx XC6SLX150T-3FG676I is a FPGA with 147443 logic cells, 11519 CLBs, and 396 inputs/outputs. It operates at max frequency of 862 MHz, suitable for industrial applications requiring high-speed processing in temperatures ranging from -40 to 100°C.

Median Price

$673.400

Lifecycle Status

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5

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Nova Conductors

Japan . 650 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 486 parts In-Stock

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$9.701

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Semicontronic

India . 434 parts In-Stock

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Ampacity Inc.

Singapore . 1,093 parts In-Stock

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One Stop Electronics

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Modulus Dynamics

Lithuania . 447 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 300 parts In-Stock

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$220.819

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$211.986

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Vigor

Singapore . 784 parts In-Stock

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Qasali Group International

UK . 150 parts In-Stock

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Argo Parts USA

USA . 3,853 parts In-Stock

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$673.400

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$666.666

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$659.932

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$653.198

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Continental Prestige Electronics

USA . 3,221 parts In-Stock

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Netroflash

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Microchip USA

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Lixinc

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Overview

Unleash the power of innovation with the Xilinx XC6SLX150T-3FG676I Field Programmable Gate Array. Manufactured by a trusted industry leader, this FPGA offers unparalleled quality and reliability. Ideal for applications requiring high-performance computing, this product delivers exceptional speed and efficiency. With its advanced technology and versatile design, the XC6SLX150T-3FG676I provides customers with unmatched value and endless possibilities for customization. Experience the next level of programmable logic devices with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical protection and insulation for the internal components of the FPGA.

No. of Logic Cells: 147443

Offers a high level of programmable logic for complex applications.

Surface Mount: YES

Allows for easy and secure integration onto circuit boards.

Maximum Supply Voltage: 1.26 V

Ensures safe operation within specified voltage limits.

No. of CLBs: 11519

Provides a large number of configurable logic blocks for versatile programming options.

Technology Used: CMOS

Utilizes advanced CMOS technology for efficient power consumption and high performance.

No. of Inputs: 396

Offers a high number of input channels for data processing and manipulation.

Package Shape: SQUARE

Facilitates uniform and efficient placement on circuit boards.

Nominal Supply Voltage (V): 1.2

Standard voltage level for consistent performance.

Power Supplies (V): 1.2,2.5/3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 676

Provides sufficient connection points for interfacing with external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for reprogramming and customization for specific applications.

Package Style (Meter): GRID ARRAY

Enables efficient arrangement and connection of terminals in a grid pattern.

Minimum Supply Voltage: 1.14 V

Ensures operational reliability even at lower voltage levels.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures for extended operation in harsh environments.

Pitch Of Terminal: 1 mm

Provides a standard spacing for easy connection to external components.

Maximum Combinatorial Delay of a CLB: 0.21 ns

Provides fast processing speed for real-time applications.

Organization: 11519 CLBS

Offers a highly organized structure for efficient logic implementation.

Minimum Operating Temperature: -40 °C

Can function reliably even in extremely low temperatures.

Finishing Of Terminal Used: TIN LEAD

Provides reliable electrical connections and prevents corrosion of terminals.

Position Of Terminal: BOTTOM

Enables easy and secure placement on circuit boards.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture damage during assembly and operation.

Maximum Seated Height: 2.44 mm

Has a compact profile for space-efficient designs.

Width: 27 mm

Offers a standard width for compatibility with various mounting configurations.

Maximum Clock Frequency: 862 MHz

Supports high-speed data processing and communication.

No. of Outputs: 396

Provides a high number of output channels for transmitting processed data.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly within specified time limits.

Peak Reflow Temperature °C: 225

Indicates the maximum temperature for solder reflow processes.

Length: 27 mm

Offers a standard length for integration into circuit board layouts.

Grading Of Temperature: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX150T-3FG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

147443

No. of Inputs:

396

No. of Outputs:

396

No. of CLBs:

11519

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

11519 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC6SLX150T-3FG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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