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W29N01HZBINA

Winbond Electronics

W29N01HZBINA by Winbond Electronics

W29N01HZBINA by Winbond Electronics is a 128MX8 SLC NAND flash memory with 1.8V programming voltage. Operating in industrial temperature range (-40 to 85 °C), it offers high memory density of 1073741824 bits for parallel applications. The package style is grid array, very thin profile, fine pitch, making it suitable for various embedded systems and storage solutions.

Median Price

$3.738

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 90 parts In-Stock

1+ parts

$3.471

100+ parts

$3.294

1k+ parts

-

10k+ parts

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90

$3.471

$3.294

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Mouser Electronics

USA . 205 parts In-Stock

1+ parts

$5.950

100+ parts

-

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205

$5.950

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Verical

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$3.294

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90

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$3.294

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RS (Exports)

UK . 81 parts In-Stock

1+ parts

-

100+ parts

$4.006

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81

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$4.006

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TECHDesign

Taiwan . 1,235 parts In-Stock

1+ parts

$2.760

100+ parts

$2.590

1k+ parts

$2.400

10k+ parts

-

1,235

$2.760

$2.590

$2.400

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.910

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500

$2.910

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Vyrian

USA . 6,539 parts In-Stock

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6,539

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Distributors (Availability)

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AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$19.561

100+ parts

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254

$19.561

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Formix International (Excess)

India . 12,232 parts In-Stock

1+ parts

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12,232

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Infinite Electronics LLP (Excess)

. 1,689 parts In-Stock

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1,689

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Allen Electronics Distributors

USA . 81 parts In-Stock

1+ parts

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100+ parts

$3.156

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81

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$3.156

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$2.852

1k+ parts

$2.765

10k+ parts

$2.706

50

-

$2.852

$2.765

$2.706

Overview

Experience top-notch quality and reliability with the W29N01HZBINA from Winbond Electronics, a leading manufacturer in the industry. This Flash Memory device offers seamless integration for various applications, providing customers with unparalleled value and performance. Whether you're looking to enhance your industrial equipment or optimize your networking devices, this product's advanced technology and robust design make it the ideal choice. Trust Winbond Electronics to deliver exceptional products that meet your needs and exceed your expectations. Elevate your projects with the W29N01HZBINA today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight, durable, and cost-effective.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and enabling automated assembly processes.

Nominal Supply Voltage (Vsup): 1.8V

Operates efficiently at a lower voltage, reducing power consumption and heat generation.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance in demanding conditions.

Memory Density: 1073741824 bit

Offers high memory density for storing large amounts of data in a compact form factor.

Technical Specifications

Flash Memory W29N01HZBINA attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

JESD-30 Code:

R-PBGA-B63

Length:

11 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

63

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

1.8

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

SLC NAND TYPE

Width:

9 mm

Trade Compliance

W29N01HZBINA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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