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W29N01HVSINA

Winbond Electronics

W29N01HVSINA by Winbond Electronics

W29N01HVSINA by Winbond Electronics is a 128Mx8 SLC NAND flash memory with 1073741824-bit memory density. Operating at 3.3V, it has an industrial temperature grade and supports parallel interface. With a small outline package style, it is suitable for applications requiring high-speed data storage in harsh environments.

Median Price

$2.835

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 1 parts In-Stock

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$2.835

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$2.835

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Distributors (In-Stock)

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Nova Conductors

Japan . 46 parts In-Stock

1+ parts

$2.300

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46

$2.300

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TECHDesign

Taiwan . 1,163 parts In-Stock

1+ parts

$2.610

100+ parts

$2.450

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$2.270

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1,163

$2.610

$2.450

$2.270

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Chip Stock

USA . 53,177 parts In-Stock

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Cyclops Electronics Ltd

UK . 15,360 parts In-Stock

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Vyrian

USA . 8,649 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,945 parts In-Stock

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2,945

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Distributors (Availability)

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Argo Parts USA

USA . 4,824 parts In-Stock

1+ parts

$2.300

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4,824

$2.300

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Continental Prestige Electronics

USA . 897 parts In-Stock

1+ parts

$2.300

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$2.254

897

$2.300

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$2.254

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.300

100+ parts

-

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$2.185

10k+ parts

$2.139

100

$2.300

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$2.185

$2.139

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$6.430

100+ parts

$5.851

1k+ parts

$5.273

10k+ parts

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500

$6.430

$5.851

$5.273

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AZTECH Wire

Italy . 812 parts In-Stock

1+ parts

$15.379

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812

$15.379

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Microchip USA

USA . 5,864 parts In-Stock

1+ parts

$19.956

100+ parts

$19.834

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$19.834

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$19.834

5,864

$19.956

$19.834

$19.834

$19.834

RC Electronics

USA . 38,162 parts In-Stock

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Futuretech Components

Singapore . 22,798 parts In-Stock

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Perfect Parts

USA . 17,920 parts In-Stock

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GreenTree Electronics

Israel . 16,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,494 parts In-Stock

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iodParts Technologies Inc.

India . 12,499 parts In-Stock

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S.R.D Solutions

India . 10,000 parts In-Stock

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Kepictronics

USA . 768 parts In-Stock

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768

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience the unmatched quality and reliability of Winbond Electronics with the W29N01HVSINA Flash Memory. This cutting-edge product offers seamless integration, high performance, and exceptional durability for a wide range of applications. From industrial automation to consumer electronics, this flash memory provides the perfect solution for your data storage needs. Trust Winbond Electronics to deliver superior technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, saving time and space in the design process.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor for easy integration into various electronic systems.

Operating Mode: ASYNCHRONOUS

The asynchronous operation offers flexibility and simplicity in data transfer, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3

The 3V supply voltage ensures compatibility with many systems, providing reliable performance.

No. of Terminals: 48

The 48 terminals allow for multiple connections, enabling efficient communication and data transfer.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design save space on a circuit board, making it ideal for compact devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Organization: 128MX8

The 128MX8 organization offers high memory density, allowing for large amounts of data storage in a small footprint.

Minimum Operating Temperature: -40 °C

The product can operate in extreme temperatures, making it suitable for use in various environments.

Terminal Position: DUAL

The dual terminal position provides redundancy and reliability in connection, enhancing the product's durability.

Maximum Seated Height: 1.2 mm

The low seated height allows for a slim and compact design, perfect for space-constrained applications.

Technical Specifications

Flash Memory W29N01HVSINA attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

JESD-30 Code:

R-PDSO-G48

Length:

18.4 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

48

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3.3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

SLC NAND TYPE

Width:

12 mm

Trade Compliance

W29N01HVSINA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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