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W29N01GVSIAA

Winbond Electronics

W29N01GVSIAA by Winbond Electronics

W29N01GVSIAA by Winbond Electronics is a 3.3V SLC NAND Flash Memory with 128Mx8 organization, operating in industrial temperature range of -40 to 85°C. It features parallel interface, 48 terminals, and compact dimensions of 12mm width and 18.4mm length. Ideal for applications requiring high-density memory storage in harsh environments.

Median Price

$1.650

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$1.650

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Chip Stock

USA . 22,100 parts In-Stock

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Vyrian

USA . 2,978 parts In-Stock

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Vectronix, Inc

USA . 133 parts In-Stock

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PC Components Company LLC

USA . 50 parts In-Stock

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50

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Bristol Electronics

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,365 parts In-Stock

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$1.650

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$1.617

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Argo Parts USA

USA . 1,807 parts In-Stock

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$1.650

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AZTECH Wire

Italy . 655 parts In-Stock

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$14.230

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655

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Kepictronics

USA . 1,526 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$1.617

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$1.568

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$1.535

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ChipstoGo Electronic ltd

UK . 728 parts In-Stock

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GreenTree Electronics

Israel . 310 parts In-Stock

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Overview

Unlock the power of reliable and high-quality flash memory with the W29N01GVSIAA by Winbond Electronics. As a leading manufacturer in the industry, Winbond Electronics ensures top-notch performance and durability in every product they create. Ideal for a wide range of applications, this flash memory offers seamless operation and efficient data storage. Experience the value and benefits of this product, from its industrial-grade temperature tolerance to its compact design. Trust Winbond Electronics to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for portable electronics.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent read and write operations, increasing flexibility and performance in data transfer.

Nominal Supply Voltage (Vsup): 3.3V

The 3.3V supply voltage is commonly used in many electronic devices, ensuring compatibility with existing systems.

Memory Density: 1073741824 bit

High memory density allows for storing a large amount of data in a compact form factor, making it suitable for applications with high storage requirements.

Technical Specifications

Flash Memory W29N01GVSIAA attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

JESD-30 Code:

R-PDSO-G48

Length:

18.4 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

48

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3.3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Type:

SLC NAND TYPE

Width:

12 mm

Trade Compliance

W29N01GVSIAA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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