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W25R256JVEIQTR

Winbond Electronics

W25R256JVEIQTR by Winbond Electronics

W25R256JVEIQTR by Winbond Electronics is a NOR type flash memory with 32MX8 organization, SPI serial bus, and 133 MHz clock frequency. It operates at -40 to 85 °C and has a 100000 write/erase cycle endurance. Ideal for industrial applications requiring high-speed data storage in compact devices.

Median Price

$6.300

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,370 parts In-Stock

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$6.300

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3,370

$6.300

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Vyrian

USA . 5,778 parts In-Stock

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5,778

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Nova Conductors

Japan . 37 parts In-Stock

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37

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Distributors (Availability)

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Argo Parts USA

USA . 3,634 parts In-Stock

1+ parts

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3,634

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Continental Prestige Electronics

USA . 381 parts In-Stock

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381

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Boost your electronics with the high-quality W25R256JVEIQTR flash memory by Winbond Electronics. This cutting-edge product offers unparalleled value, providing fast and reliable storage solutions for a wide range of applications. From consumer electronics to industrial automation, Winbond Electronics sets the standard for excellence in flash memory technology. Upgrade your devices today and experience the superior performance and benefits that Winbond Electronics has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability to the flash memory, ensuring it can withstand various environmental conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for high-speed data transfer and efficient performance, making this flash memory a suitable choice for applications requiring quick access to data.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this flash memory efficient in terms of power consumption and suitable for use in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this flash memory can handle elevated temperatures without compromising its performance, making it ideal for industrial applications.

Memory Density: 268435456 bit

High memory density allows for storing a large amount of data in a compact form, making this flash memory suitable for storing multimedia files, operating systems, and other data-intensive applications.

Technical Specifications

Flash Memory W25R256JVEIQTR attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Additional Features:

ALSO OPERATES AT 104MHZ AT 2.7-3.0V

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000025 Amp

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

6 mm

Write Protection:

SOFTWARE

Trade Compliance

W25R256JVEIQTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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