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W25Q64FWZPIQ

Winbond Electronics

W25Q64FWZPIQ by Winbond Electronics

Winbond Electronics' W25Q64FWZPIQ is a 64Mbit flash memory with synchronous operation at up to 104MHz. It has a small outline package, operates in industrial temperature range (-40°C to 85°C), and uses serial communication. Ideal for applications requiring high-speed data storage in compact devices.

Median Price

$0.592

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$0.135

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3

$0.135

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Chip1Stop

Japan . 3 parts In-Stock

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$1.050

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3

$1.050

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Distributors (In-Stock)

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Nova Conductors

Japan . 35 parts In-Stock

1+ parts

$0.832

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35

$0.832

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Vyrian

USA . 2,543 parts In-Stock

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2,543

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J2 Sourcing AB

Sweden . 20 parts In-Stock

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20

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Electronics Depot

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$0.815

100+ parts

-

1k+ parts

$0.783

10k+ parts

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50

$0.815

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$0.783

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Continental Prestige Electronics

USA . 5,715 parts In-Stock

1+ parts

$0.832

100+ parts

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1k+ parts

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$0.815

5,715

$0.832

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$0.815

Argo Parts USA

USA . 3,529 parts In-Stock

1+ parts

$0.832

100+ parts

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3,529

$0.832

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AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$11.734

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368

$11.734

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Kepictronics

USA . 54,267 parts In-Stock

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Overview

Unlock the power of reliable and high-quality flash memory with the W25Q64FWZPIQ by Winbond Electronics. Known for their exceptional craftsmanship and cutting-edge technology, Winbond Electronics delivers top-notch products that exceed expectations. Ideal for a wide range of applications, this flash memory offers customers unparalleled value, benefits, and advantages. Whether you're looking to enhance your devices' performance or streamline your operations, the W25Q64FWZPIQ is the perfect solution for all your memory needs. Trust Winbond Electronics to provide you with the best in flash memory technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

The surface mount feature allows for easy and secure installation of the flash memory.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and efficient data transfer, improving overall performance.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage helps in reducing power consumption, making it energy efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the flash memory to function reliably in various environments.

Memory Density: 67108864 bit

The high memory density provides ample storage capacity for data, making it suitable for multiple applications.

Technical Specifications

Flash Memory W25Q64FWZPIQ attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

1.8

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

W25Q64FWZPIQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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