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W25Q32JVSFIQ

Winbond Electronics

W25Q32JVSFIQ by Winbond Electronics

W25Q32JVSFIQ by Winbond Electronics is a 4MX8 flash memory with a memory density of 33554432 bit. It operates at a max clock frequency of 133 MHz and has an industrial temperature grade. It is commonly used in applications that require high-speed data storage and retrieval.

Median Price

$0.814

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Chip1Stop

Japan . 412 parts In-Stock

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$0.767

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Arrow

USA . 238 parts In-Stock

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$0.814

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Verical

USA . 238 parts In-Stock

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Nova Conductors

Japan . 36 parts In-Stock

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$0.630

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TECHDesign

Taiwan . 27,758 parts In-Stock

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$0.840

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$0.750

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$0.650

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Chip Stock

USA . 4,316 parts In-Stock

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Vyrian

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Elcom Components

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ComSIT Distribution GmbH

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PC Components Company LLC

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Bristol Electronics

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Aranea Global

USA . 50 parts In-Stock

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$0.617

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$0.593

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Argo Parts USA

USA . 1,691 parts In-Stock

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$0.630

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$0.611

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Continental Prestige Electronics

USA . 1,110 parts In-Stock

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$0.630

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$0.617

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AZTECH Wire

Italy . 288 parts In-Stock

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$19.103

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Authorized Procurement Solutions

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Kepictronics

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Overview

Experience the ultimate in high-quality flash memory with the W25Q32JVSFIQ by Winbond Electronics. As a leading manufacturer in the industry, Winbond Electronics ensures top-notch performance and reliability. This flash memory device is perfect for a wide range of applications, from consumer electronics to industrial equipment. With its compact size and synchronous operating mode, it offers seamless integration and efficient operation. The W25Q32JVSFIQ boasts a nominal supply voltage of 3.3V and a maximum clock frequency of 133 MHz, delivering outstanding speed and power efficiency. Trust Winbond Electronics to provide you with a superior flash memory solution that delivers value, benefits, and advantages to meet all your needs. Upgrade your devices with the W25Q32JVSFIQ and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the flash memory, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient to integrate the flash memory into compact electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard designs and facilitates efficient placement on PCBs, contributing to the ease of integration.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for fast and efficient data transfer, enhancing the overall performance and responsiveness of the flash memory.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems, making the flash memory suitable for various electronics projects.

No. of Terminals: 16

With 16 terminals, the flash memory offers sufficient connectivity options, facilitating seamless integration with other components and enabling efficient data flow.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact form factor, allowing for space-efficient installation and making it an ideal choice for applications with limited space.

Maximum Operating Temperature: 85 °C

The flash memory's ability to operate in temperatures of up to 85°C ensures reliability and performance even in demanding environments.

Organization: 4MX8

With an organization of 4MX8, the flash memory offers a high storage capacity, accommodating large amounts of data and making it suitable for memory-intensive applications.

Minimum Operating Temperature: -40 °C

The flash memory's capability to operate in temperatures as low as -40°C ensures its reliability and performance in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring the longevity and robustness of the flash memory.

Terminal Position: DUAL

With dual terminal positions, the flash memory offers flexibility in installation, allowing for different mounting orientations and facilitating ease of use in various applications.

Maximum Seated Height: 2.64 mm

The flash memory's low maximum seated height enables it to be installed in slim devices without compromising space constraints, making it suitable for compact designs.

Maximum Clock Frequency (fCLK): 133 MHz

With a maximum clock frequency of 133 MHz, the flash memory can quickly and efficiently process data, ensuring smooth operation and high-speed performance.

Width: 7.49 mm

The flash memory's compact width allows for easy integration into space-constrained devices, providing convenience and flexibility in design and implementation.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources, making the flash memory versatile and adaptable to various systems.

Peak Reflow Temperature °C: 260

The flash memory's peak reflow temperature of 260°C enables reliable soldering during the manufacturing process, ensuring secure and durable connections.

Length: 10.31 mm

The flash memory's length provides a compact yet sufficient form factor, allowing for easy installation and integration into various electronic devices.

Programming Voltage (V): 3

The programming voltage of 3V ensures compatibility with standard programming methods, simplifying the process of writing data to the flash memory.

Temperature Grade: INDUSTRIAL

The flash memory's industrial temperature grade ensures reliable performance and stability in harsh operating conditions, making it suitable for industrial applications with demanding environments.

Technology: CMOS

The CMOS technology employed in the flash memory provides low power consumption, high speed, and reliability, making it an efficient and dependable choice for memory storage solutions.

Parallel or Serial: SERIAL

The flash memory's serial interface allows for efficient data transfer, reducing wiring complexity and enabling seamless integration into various systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections, ensuring the flash memory's reliability and robustness in electronic assemblies.

No. of Words: 4194304 words

With a capacity of 4194304 words, the flash memory offers ample storage space for data-intensive applications, providing a reliable and efficient memory solution.

Memory Width: 8

The flash memory's memory width of 8 bits allows for efficient data retrieval and processing, contributing to its overall performance and suitability for various applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides sufficient spacing between terminals for easy soldering and assembly, enhancing the flash memory's usability in electronic projects.

No. of Words Code: 4M

The 4M no. of words code indicates a large storage capacity of 4 million words, making the flash memory an ideal choice for applications requiring extensive data storage.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, the flash memory offers flexibility in power source selection, accommodating a wide range of systems and power requirements.

Memory Density: 33554432 bit

The flash memory's high memory density of 33554432 bits allows for substantial data storage, making it a valuable choice for applications with large volumes of information.

Memory IC Type: FLASH

The flash memory's IC type indicates its storage capability, providing non-volatile memory solutions for various electronic devices.

Technical Specifications

Flash Memory W25Q32JVSFIQ attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Additional Features:

2.7V NOMINAL AVAILABLE WITH 104MHZ

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

133 MHz

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.31 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

3

Maximum Seated Height:

2.64 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.49 mm

Trade Compliance

W25Q32JVSFIQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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