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W25Q32FVSSIQ

Winbond Electronics

W25Q32FVSSIQ by Winbond Electronics

W25Q32FVSSIQ by Winbond Electronics is a NOR type flash memory with 32Mx1 organization, SPI serial bus type, and 104 MHz clock frequency. It operates at temperatures ranging from -40 to 85°C and has a small outline package suitable for industrial applications. With 100000 write/erase cycles endurance, it is ideal for embedded systems requiring reliable non-volatile memory storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,077 parts In-Stock

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2,077

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 242 parts In-Stock

1+ parts

$4.464

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242

$4.464

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Corohmni

South Africa . 418 parts In-Stock

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$5.457

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418

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AZTECH Wire

Italy . 828 parts In-Stock

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$11.026

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828

$11.026

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Argo Parts USA

USA . 4,774 parts In-Stock

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4,774

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Continental Prestige Electronics

USA . 1,497 parts In-Stock

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1,497

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Aranea Global

USA . 1,000 parts In-Stock

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Kepictronics

USA . 132 parts In-Stock

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Overview

Experience fast and reliable data storage with the W25Q32FVSSIQ Flash Memory by Winbond Electronics. As a leading manufacturer in the industry, Winbond Electronics delivers top-notch quality products that guarantee superior performance and durability. Ideal for a wide range of applications, this flash memory offers value and benefits such as high-speed data transfer, secure write protection, and long-lasting endurance. Upgrade your devices with the W25Q32FVSSIQ for a seamless and efficient user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the flash memory, making it resistant to damage and suitable for various environments.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer speeds and more efficient use of the memory, making the product perform better in high-demand applications.

Maximum Clock Frequency (fCLK): 104 MHz

High clock frequency enables quick access to data and improves overall performance of the flash memory, making it ideal for time-sensitive tasks.

Memory Density: 33554432 bit

With a high memory density, this flash memory can store a large amount of data in a compact space, making it suitable for applications that require a lot of storage.

Endurance: 100000 Write/Erase Cycles

High endurance ensures that the flash memory can withstand frequent read and write operations without degradation, making it reliable and long-lasting.

Technical Specifications

Flash Memory W25Q32FVSSIQ attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

Length:

5.23 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

2.16 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q32FVSSIQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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