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W25Q32FVSFIG

Winbond Electronics

W25Q32FVSFIG by Winbond Electronics

Winbond Electronics' W25Q32FVSFIG is a 32M NOR Flash Memory with SPI interface. It operates at 3V, supports up to 104MHz clock frequency, and has 100K Write/Erase cycles endurance. Ideal for industrial applications requiring high-speed data storage in compact form factors.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 5,500 parts In-Stock

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Vyrian

USA . 4,567 parts In-Stock

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

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Nova Conductors

Japan . 61 parts In-Stock

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Benley Electronics

USA . 4 parts In-Stock

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$0.650

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Corohmni

South Africa . 655 parts In-Stock

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$3.543

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$3.621

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$3.295

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$2.969

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Aztec Data Supply Inc.

USA . 209 parts In-Stock

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$4.202

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AZTECH Wire

Italy . 456 parts In-Stock

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$5.601

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Metaverse IC Inc.

Canada . 15,116 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,338 parts In-Stock

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Continental Prestige Electronics

USA . 3,049 parts In-Stock

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Aranea Global

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Authorized Procurement Solutions

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Argo Parts USA

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Kepictronics

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Overview

Unlock the power of reliable and efficient data storage with the W25Q32FVSFIG by Winbond Electronics. As a leading manufacturer in the industry, Winbond Electronics delivers top-quality flash memory solutions for a wide range of applications. The W25Q32FVSFIG offers customers unmatched value with its high performance, low power consumption, and durable design. Whether you're looking to upgrade your electronics or enhance your industrial systems, this product provides the perfect solution for all your memory needs. Trust Winbond Electronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Operating Mode: SYNCHRONOUS

Allows for faster and more efficient data transfer and processing.

Maximum Clock Frequency (fCLK): 104 MHz

Enables high-speed performance for seamless data access and transfer.

Write Protection: HARDWARE/SOFTWARE

Enhances security by allowing users to protect their data from unauthorized access or modification.

Endurance: 100000 Write/Erase Cycles

Provides reliability and longevity by allowing the product to withstand frequent read/write operations.

Memory Density: 33554432 bit

Offers ample storage capacity for storing a large amount of data and files.

Technical Specifications

Flash Memory W25Q32FVSFIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

Length:

10.31 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

16

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

7.49 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q32FVSFIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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