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SQM120P04-04L-GE3

Vishay Intertechnology

SQM120P04-04L-GE3 by Vishay Intertechnology

Vishay Intertechnology's SQM120P04-04L-GE3 is a P-channel FET with 40V DS breakdown voltage, 120A max drain current, and 0.004 ohm RDS(on). Ideal for power applications in enhancement mode operation, featuring a built-in diode and Gull Wing terminals. Operates at up to 175°C with 330A pulsed drain current capability.

Median Price

$2.748

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Element14

Singapore . 863 parts In-Stock

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$3.715

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$2.447

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$1.772

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863

$3.715

$2.447

$1.772

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Farnell

UK . 863 parts In-Stock

1+ parts

$4.036

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$2.378

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$1.735

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863

$4.036

$2.378

$1.735

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Newark

USA . 322 parts In-Stock

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$4.120

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$2.210

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Future Electronics

Canada . 800 parts In-Stock

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$1.780

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$1.760

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$1.760

Arrow

USA . 800 parts In-Stock

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$1.660

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$1.660

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Verical

USA . 800 parts In-Stock

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$1.660

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800

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$1.660

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Distributors (In-Stock)

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Nova Conductors

Japan . 78 parts In-Stock

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$2.370

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Vyrian

USA . 3,214 parts In-Stock

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Chip Stock

USA . 925 parts In-Stock

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Cyclops Electronics Ltd

UK . 800 parts In-Stock

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800

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NAC Semi

USA . 800 parts In-Stock

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$2.640

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800

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$2.640

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IBS Electronics

USA . 800 parts In-Stock

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$4.151

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$4.081

800

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$4.081

Contempo Components LLC

USA . 18 parts In-Stock

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Corohmni

South Africa . 439 parts In-Stock

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$0.031

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439

$0.031

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Aztec Data Supply Inc.

USA . 3,506 parts In-Stock

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$0.720

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$0.720

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Ampacity Inc.

Singapore . 3,113 parts In-Stock

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$1.400

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Argo Parts USA

USA . 3,091 parts In-Stock

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$2.370

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Netroflash

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,551 parts In-Stock

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$2.370

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$2.322

1,551

$2.370

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$2.322

Andel Nordic

Denmark . 4,889 parts In-Stock

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$6.394

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$6.139

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$6.139

4,889

$6.394

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$6.139

Microchip USA

USA . 7,153 parts In-Stock

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$14.805

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Robosynatics

Brazil . 28,658 parts In-Stock

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Kepictronics

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Overview

Discover the power of the SQM120P04-04L-GE3 by Vishay Intertechnology, a high-quality P-channel Power FET that offers unmatched performance and reliability. With a maximum drain current of 120A and a low on-resistance of just 0.004 ohm, this transistor is perfect for a wide range of applications. Whether you need efficient power management or reliable switching capabilities, this FET delivers. Trust Vishay Intertechnology's expertise in semiconductor technology to provide you with a top-of-the-line solution that meets all your needs. Experience the difference with the SQM120P04-04L-GE3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal stability, making it a reliable choice for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low ON resistance and high input impedance, making them suitable for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better protection against reverse polarity and voltage spikes, enhancing the overall reliability of the circuit.

Surface Mount: YES

The surface mount capability makes it easy to integrate into compact electronic designs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle higher power loads, ensuring reliable performance in challenging conditions.

Package Shape: RECTANGULAR

The rectangular shape is versatile and easy to mount, making it suitable for a wide range of applications and design requirements.

Terminal Form: GULL WING

The gull wing terminals provide secure connections and easy soldering, improving overall stability and reliability in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and low ON resistance, making them ideal for high-efficiency power management applications.

Maximum Pulsed Drain Current (IDM): 330 A

The high pulsed drain current rating allows for handling sudden surges of power, ensuring stable performance under peak load conditions.

Avalanche Energy Rating (EAS): 320 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events, increasing the reliability of the circuit.

No. of Terminals: 2

With a simple two-terminal design, this FET is easy to integrate and offers flexibility in circuit layout and connection options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic designs with limited real estate.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency, fast switching speeds, and low ON resistance, making it a reliable choice for power management applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate reliably in demanding environments without a risk of overheating.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and stability, ensuring consistent performance over time.

Maximum Drain Current (ID): 120 A

The high maximum drain current rating allows for the FET to handle large power loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.004 ohm

The low ON resistance minimizes power loss and heat generation, improving overall efficiency and performance of the circuit.

Terminal Position: SINGLE

With a single terminal position, this FET offers simplicity in connection and installation, making it user-friendly and easy to integrate into circuits.

Maximum Time At Peak Reflow Temperature (s): 40

The FET can withstand peak reflow temperatures for extended periods, ensuring reliable solder connections during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates the FET's ability to withstand high-temperature soldering processes without degradation in performance.

Technical Specifications

Power Field Effect Transistors (FET) SQM120P04-04L-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

320 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.004 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

330 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Element Material:

SILICON

Trade Compliance

SQM120P04-04L-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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