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SQM110P06-8M9L_GE3

Vishay Intertechnology

SQM110P06-8M9L_GE3 by Vishay Intertechnology

Vishay Intertechnology's SQM110P06-8M9L_GE3 is a P-channel power FET with 60V DS breakdown voltage and 230A pulsed drain current. Ideal for enhancement mode operation, it features 0.0089 ohm max RDS(on) and 211mJ avalanche energy rating. Widely used in applications requiring high-power switching capabilities.

Median Price

$4.230

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,295 parts In-Stock

1+ parts

$2.661

100+ parts

$1.956

1k+ parts

$1.444

10k+ parts

$1.394

2,295

$2.661

$1.956

$1.444

$1.394

Chip1Stop

Japan . 2,295 parts In-Stock

1+ parts

$4.230

100+ parts

$1.770

1k+ parts

$1.570

10k+ parts

-

2,295

$4.230

$1.770

$1.570

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Element14

Singapore . 3,111 parts In-Stock

1+ parts

$4.450

100+ parts

$2.850

1k+ parts

$2.230

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-

3,111

$4.450

$2.850

$2.230

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Newark

USA . 56 parts In-Stock

1+ parts

$5.090

100+ parts

$2.510

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-

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56

$5.090

$2.510

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Verical

USA . 200 parts In-Stock

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$0.955

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200

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$0.955

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Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$2.220

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-

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550

$2.220

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Chip Stock

USA . 16,672 parts In-Stock

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16,672

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Vyrian

USA . 4,456 parts In-Stock

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4,456

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Rutronik

Germany . 4,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$2.060

10k+ parts

$1.640

4,000

-

-

$2.060

$1.640

NAC Semi

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.040

10k+ parts

$4.580

1,600

-

-

$5.040

$4.580

ComSIT Distribution GmbH

Germany . 989 parts In-Stock

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ComSIT USA

USA . 989 parts In-Stock

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989

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,346 parts In-Stock

1+ parts

$1.220

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4,346

$1.220

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Semicontronic

India . 4,104 parts In-Stock

1+ parts

$1.220

100+ parts

$1.190

1k+ parts

$1.183

10k+ parts

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4,104

$1.220

$1.190

$1.183

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Corohmni

South Africa . 913 parts In-Stock

1+ parts

$1.408

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913

$1.408

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Aztec Data Supply Inc.

USA . 3,064 parts In-Stock

1+ parts

$1.480

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3,064

$1.480

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Argo Parts USA

USA . 956 parts In-Stock

1+ parts

$2.050

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956

$2.050

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.220

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2,000

$2.220

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Continental Prestige Electronics

USA . 1,600 parts In-Stock

1+ parts

$2.940

100+ parts

$1.640

1k+ parts

$1.310

10k+ parts

-

1,600

$2.940

$1.640

$1.310

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Microchip USA

USA . 8,910 parts In-Stock

1+ parts

$13.160

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8,910

$13.160

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Robosynatics

Brazil . 7,487 parts In-Stock

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7,487

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Lucentia Tech

USA . 7,487 parts In-Stock

1+ parts

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100+ parts

$1.477

1k+ parts

$1.447

10k+ parts

$1.447

7,487

-

$1.477

$1.447

$1.447

Overview

Unleash the power of innovation with Vishay Intertechnology's SQM110P06-8M9L_GE3 Power FET! Designed for high-performance applications, this P-channel transistor offers unparalleled quality and reliability. With a maximum pulsing drain current of 230A and an impressive 60V breakdown voltage, this transistor is perfect for demanding projects where efficiency is key. Whether you're looking to optimize power management or improve system performance, the SQM110P06-8M9L_GE3 delivers exceptional value and benefits that will take your project to the next level. Upgrade your design with Vishay Intertechnology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good resistance to heat and moisture, making the FET durable and reliable.

Polarity or Channel Type: P-CHANNEL

P-channel FETs offer lower ON-resistance and higher current carrying capabilities compared to N-channel FETs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode enhances protection against reverse current flow, increasing the reliability of the FET.

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle high voltages safely, making it suitable for power applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and efficient use of space on PCBs.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connection and ease of soldering during assembly, ensuring reliable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage signal to turn on, offering better control over the switching operation.

Maximum Pulsed Drain Current (IDM): 230 A

High pulsed drain current rating allows the FET to handle short-duration high-power loads, making it suitable for pulse applications.

Avalanche Energy Rating (EAS): 211 mJ

High avalanche energy rating indicates the FET's ability to withstand high energy spikes, improving its reliability in harsh environments.

No. of Terminals: 2

Two terminals simplify the installation process and reduce the chances of wiring errors, making the FET easy to use.

Package Style (Meter): SMALL OUTLINE

Small outline packaging saves space on PCBs and allows for higher component density, making it suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speeds, making the FET ideal for power management applications.

Transistor Element Material: SILICON

Silicon material provides good electrical characteristics and thermal stability, ensuring the FET operates reliably over a wide temperature range.

Maximum Drain Current (ID): 110 A

High drain current rating enables the FET to handle high continuous current flow, making it suitable for power circuits.

Maximum Drain-Source On Resistance: 0.0089 ohm

Low drain-source on resistance reduces power loss and improves efficiency during operation, making the FET an energy-efficient choice.

Terminal Position: SINGLE

Single terminal design simplifies the connection and ensures correct placement during installation, reducing assembly errors.

Technical Specifications

Power Field Effect Transistors (FET) SQM110P06-8M9L_GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

211 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0089 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

230 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

SQM110P06-8M9L_GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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