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SQM120N03-1M5L_GE3

Vishay Intertechnology

SQM120N03-1M5L_GE3 by Vishay Intertechnology

Vishay Intertechnology's SQM120N03-1M5L_GE3 is a N-channel Power FET with 30V DS Breakdown Voltage and 120A ID. Ideal for applications requiring high pulsed drain current up to 480A, such as power management systems. Features include built-in diode, 0.0015 ohm RDS(on), and EAS of 336mJ for robust performance in enhancement mode operation.

Median Price

$2.740

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1 parts In-Stock

1+ parts

$2.740

100+ parts

$1.740

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$1.160

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1

$2.740

$1.740

$1.160

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Mouser Electronics

USA . 637 parts In-Stock

1+ parts

$4.860

100+ parts

$2.450

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$1.710

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637

$4.860

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$1.710

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TTI

USA . 2,400 parts In-Stock

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$1.760

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2,400

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$1.760

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Distributors (In-Stock)

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Vyrian

USA . 5,218 parts In-Stock

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5,218

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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Corohmni

South Africa . 562 parts In-Stock

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$0.734

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562

$0.734

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Microchip USA

USA . 5,027 parts In-Stock

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$15.536

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5,027

$15.536

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Component Stockers USA

USA . 1,826 parts In-Stock

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$2.300

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1,826

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iodParts Technologies Inc.

India . 816 parts In-Stock

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Overview

Experience superior power performance with the SQM120N03-1M5L_GE3 by Vishay Intertechnology, a leading manufacturer in the industry. This N-channel Power FET offers groundbreaking technology in a small outline package, making it ideal for various applications. With a maximum drain current of 120 A and a low drain-source on resistance, this transistor provides unmatched efficiency and reliability. Trust Vishay Intertechnology to deliver top-notch quality and performance in every product. Elevate your projects with the SQM120N03-1M5L_GE3 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in the negative channel, making it suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse polarity protection.

Surface Mount: YES

Facilitates easy and convenient mounting on PCBs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 30 V

Can handle high voltage applications without risk of breakdown, ensuring reliable performance.

Package Shape: RECTANGULAR

Offers a compact and space-saving form factor, ideal for applications with limited space.

Operating Mode: ENHANCEMENT MODE

Allows for high efficiency and fast switching speeds, suitable for high-performance applications.

Maximum Pulsed Drain Current (IDM): 480 A

Can handle high current spikes without overheating, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 336 mJ

Provides protection against voltage surges and spikes, ensuring the longevity of the device.

No. of Terminals: 2

Simplified design and installation with fewer connection points.

Package Style (Meter): SMALL OUTLINE

Compact design suitable for smaller devices and applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Highly efficient technology for power management applications.

Transistor Element Material: SILICON

Provides good conductivity and reliability for the transistor element.

Maximum Drain Current (ID): 120 A

Can handle high continuous current, suitable for power applications.

Maximum Drain-Source On Resistance: 0.0015 ohm

Low resistance for efficient power transfer, minimizing power loss.

Terminal Position: SINGLE

Simplified connection with a single terminal position.

Case Connection: DRAIN

Easy connection to the drain terminal for efficient current flow.

Technical Specifications

Power Field Effect Transistors (FET) SQM120N03-1M5L_GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

336 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

SQM120N03-1M5L_GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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