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SM6T200A-M3/5B

Vishay Intertechnology

SM6T200A-M3/5B by Vishay Intertechnology

SM6T200A-M3/5B by Vishay Intertechnology is a single-configured transient suppression device with a max non-repetitive peak reverse power dissipation of 600W. It has a breakdown voltage of 200V and is commonly used for avalanche technology applications.

Median Price

$0.046

Lifecycle Status

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3

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 70 parts In-Stock

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$0.046

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$0.044

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$0.044

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70

$0.046

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Vyrian

USA . 8,328 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Ampacity Inc.

Singapore . 70 parts In-Stock

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$0.039

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70

$0.039

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Semicontronic

India . 4 parts In-Stock

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$0.039

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$0.038

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$0.038

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4

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Aztec Data Supply Inc.

USA . 78 parts In-Stock

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$0.045

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78

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$0.046

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$0.044

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$0.044

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70

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$0.044

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Corohmni

South Africa . 767 parts In-Stock

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$0.156

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AZTECH Wire

Italy . 246 parts In-Stock

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$8.323

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Continental Prestige Electronics

USA . 4,171 parts In-Stock

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Argo Parts USA

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Bastille Electronics

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Overview

Discover the SM6T200A-M3/5B by Vishay Intertechnology, the ultimate Transient Suppression Device that offers unrivaled quality and performance. With its advanced technology and robust construction, this product guarantees reliable protection against voltage spikes and transients. Ideal for a wide range of applications, this single-configured device is perfect for safeguarding sensitive electronic equipment. Experience peace of mind knowing that your devices are protected with the SM6T200A-M3/5B, designed to deliver maximum power dissipation and unmatched breakdown voltage. Say goodbye to worries and hello to superior protection with Vishay Intertechnology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material provides durability and protection for the electronic components, making it a reliable choice for transient suppression.

Config: SINGLE

The single configuration of this transient suppression device simplifies installation and ensures compatibility with various electrical systems.

Surface Mount: YES

With the surface mount capability, this device can be easily mounted onto circuit boards, saving space and allowing for efficient use of available PCB real estate.

Maximum Non Repetitive Peak Reverse Power Dissipation: 600 W

The high maximum power dissipation of 600 W enables this device to handle sudden transient voltage surges effectively, safeguarding sensitive electrical equipment.

Nominal Breakdown Voltage: 200 V

The nominal breakdown voltage of 200 V ensures reliable suppression of transient voltages above this threshold, protecting electronic components from damage.

Maximum Reverse Current: 1 uA

The extremely low maximum reverse current of 1 uA minimizes power consumption and enhances the efficiency of the device during normal operation.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into electronic systems, allowing for flexible installation options.

Reverse Test Voltage: 171 V

The reverse test voltage of 171 V indicates the maximum voltage that can be safely applied across the device's terminals without compromising its performance or causing damage.

No. of Terminals: 2

This transient suppression device features two terminals, providing a simple and reliable electrical connection for easy installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compact dimensions, making it suitable for space-constrained applications while maintaining robust transient suppression capabilities.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this device can withstand demanding environmental conditions, ensuring long-term reliability and performance.

Minimum Operating Temperature: -65 °C

The low minimum operating temperature of -65°C allows this device to function reliably in extreme cold environments, expanding its application range.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides excellent solderability, ensuring secure and reliable connections during assembly, contributing to the overall reliability of the transient suppression device.

Terminal Position: DUAL

The dual terminal position offers versatile options for connecting the device within different circuit designs, enhancing flexibility and ease of use.

Maximum Power Dissipation: 5 W

The maximum power dissipation of 5 W ensures efficient handling of transient power surges, protecting sensitive electronic components from potential damage.

Minimum Breakdown Voltage: 190 V

The minimum breakdown voltage of 190 V indicates the threshold voltage at which the device begins to suppress transient voltages, providing enhanced protection for sensitive equipment.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds specifies the thermal endurance of the device during the soldering process, ensuring proper functionality and reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C signifies the maximum temperature to which the device can be exposed during the soldering process, ensuring successful solder joints and maintaining device integrity.

Maximum Breakdown Voltage: 210 V

The high maximum breakdown voltage of 210 V indicates the device's ability to handle transient voltages above this level, providing robust protection against voltage spikes and surges.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

This device acts as a trans voltage suppressor diode, efficiently clamping excessive voltage levels and directing transient currents away from sensitive components, offering reliable transient voltage suppression.

Technology: AVALANCHE

The avalanche technology employed in this device ensures rapid response and high energy dissipation capabilities, effectively suppressing transient voltage surges and protecting downstream devices.

Terminal Form: C BEND

The C bend terminal form simplifies the soldering process and enhances mechanical stability, ensuring secure and reliable connections during installation and throughout the device's lifespan.

No. of Elements: 1

This transient suppression device consists of a single element, simplifying design integration and providing a cost-effective solution for transient voltage protection.

Maximum Repetitive Peak Reverse Voltage: 171 V

The maximum repetitive peak reverse voltage of 171 V indicates the voltage it can handle repeatedly without degradation, offering consistent and reliable protection against transient voltages.

Moisture Sensitivity Level (MSL): 1

With an MSL rating of 1, this device has a low moisture sensitivity, allowing for convenient storage and handling without the need for extensive moisture protection measures.

Polarity: UNIDIRECTIONAL

The unidirectional polarity of this device ensures that it effectively suppresses transient voltages in one direction, ideal for applications where protection from specific voltage transients is required.

Maximum Clamping Voltage: 353 V

The high maximum clamping voltage of 353 V guarantees effective suppression and clamping of transient voltages, preventing electrical damage to sensitive devices.

Diode Element Material: SILICON

The silicon diode element material provides excellent performance characteristics, such as fast response times and high current-handling capabilities, making it a reliable choice for transient suppression applications.

Technical Specifications

Transient Suppression Devices SM6T200A-M3/5B attributes and parameters. Explore more Transient Suppression Devices devices from Vishay Intertechnology

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY

Maximum Breakdown Voltage:

210 V

Minimum Breakdown Voltage:

190 V

Nominal Breakdown Voltage:

200 V

Maximum Clamping Voltage:

353 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

600 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

5 W

Maximum Repetitive Peak Reverse Voltage:

171 V

Maximum Reverse Current:

1 uA

Reverse Test Voltage:

171 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SM6T200A-M3/5B Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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