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SM6T12A-M3/52

Vishay Intertechnology

SM6T12A-M3/52 by Vishay Intertechnology

Vishay Intertechnology's SM6T12A-M3/52 is a unidirectional avalanche diode with 600W peak power dissipation, ideal for transient suppression applications. With a breakdown voltage of 12.6V and operating temperature range from -65°C to 150°C, it offers reliable protection in various electronic circuits. This surface-mount device features a small outline package with dual terminals and matte tin finish for efficient installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 9,000 parts In-Stock

1+ parts

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9,000

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Dan-Mar Components

USA . 9,000 parts In-Stock

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9,000

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Vyrian

USA . 6,129 parts In-Stock

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6,129

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ACDS - Activité Composants Distribution Service

France . 4,500 parts In-Stock

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4,500

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,487 parts In-Stock

1+ parts

$0.010

100+ parts

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1,487

$0.010

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Aztec Data Supply Inc.

USA . 120 parts In-Stock

1+ parts

$0.125

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120

$0.125

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Corohmni

South Africa . 100 parts In-Stock

1+ parts

$0.198

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100

$0.198

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AZTECH Wire

Italy . 354 parts In-Stock

1+ parts

$9.963

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354

$9.963

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Argo Parts USA

USA . 3,806 parts In-Stock

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3,806

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Continental Prestige Electronics

USA . 3,426 parts In-Stock

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3,426

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Enhance your electronic systems with the Vishay Intertechnology SM6T12A-M3/52 Transient Suppression Device. Manufactured by a trusted leader in the industry, this product offers superior quality and reliability. Ideal for applications requiring protection against voltage spikes and surges, this diode provides peace of mind for your valuable equipment. With a high power dissipation capability and wide operating temperature range, the SM6T12A-M3/52 ensures optimal performance in various environments. Invest in this cost-effective solution today and safeguard your electronics from potential damage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, perfect for applications where weight and longevity are important factors.

Config: SINGLE

The single configuration simplifies installation and maintenance, making it a convenient choice for users who prefer straightforward setups.

Surface Mount: YES

The surface mount capability allows for easy PCB assembly, saving time and effort during the manufacturing process.

Maximum Non Repetitive Peak Reverse Power Dissipation: 600 W

With a high power dissipation capacity, this product can effectively handle transient voltage surges, ensuring reliable protection for connected devices.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, making it suitable for applications where space is limited.

No. of Terminals: 2

The two terminals offer a straightforward connection setup, making it easy to integrate this product into existing circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, allowing for efficient use of board real estate.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides a reliable connection, ensuring low contact resistance and excellent solderability.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation options, catering to different circuit layouts and designs.

Maximum Power Dissipation: 5 W

The 5W maximum power dissipation rating ensures efficient energy handling, minimizing the risk of overheating during operation.

Minimum Breakdown Voltage: 11.4 V

The high minimum breakdown voltage provides robust protection against voltage spikes, safeguarding connected devices from potential damage.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds helps to streamline the manufacturing process, increasing production efficiency.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable connection integrity during assembly.

Maximum Breakdown Voltage: 12.6 V

The high maximum breakdown voltage offers enhanced safety against voltage transients, providing dependable protection for sensitive electronics.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

This diode type is specifically designed for transient voltage suppression, offering effective voltage clamping to shield connected equipment.

Technology: AVALANCHE

The avalanche technology employed in this product enables rapid response to voltage spikes, ensuring quick and efficient protection for electronic devices.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process, enhancing the ease of installation and reducing the risk of connection issues.

Maximum Repetitive Peak Reverse Voltage: 10.2 V

The high maximum repetitive peak reverse voltage ensures reliable performance in repetitive transient events, maintaining continuous protection for devices.

Polarity: UNIDIRECTIONAL

The unidirectional polarity focuses protection on one direction, providing targeted safeguarding against transient voltages from specific sources.

Diode Element Material: SILICON

The silicon diode element material offers superior performance characteristics, including high efficiency and durability, ensuring long-term reliability for the product.

Technical Specifications

Transient Suppression Devices SM6T12A-M3/52 attributes and parameters. Explore more Transient Suppression Devices devices from Vishay Intertechnology

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY

Maximum Breakdown Voltage:

12.6 V

Minimum Breakdown Voltage:

11.4 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-214AA

JESD-30 Code:

R-PDSO-J2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

600 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

5 W

Maximum Repetitive Peak Reverse Voltage:

10.2 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SM6T12A-M3/52 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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