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SIHD6N62E-GE3

Vishay Intertechnology

SIHD6N62E-GE3 by Vishay Intertechnology

Vishay Intertechnology's SIHD6N62E-GE3 is a N-channel FET with 620V DS breakdown voltage and 12A pulsed drain current, ideal for switching applications. Featuring a built-in diode, it operates in enhancement mode with 0.9 ohm max on-resistance. The transistor has a max power dissipation of 78W and can withstand temperatures up to 150°C.

Median Price

$0.261

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Arrow

USA . 1,732 parts In-Stock

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$0.050

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$0.050

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Mouser Electronics

USA . 2,405 parts In-Stock

1+ parts

$2.440

100+ parts

$1.040

1k+ parts

$0.750

10k+ parts

$0.683

2,405

$2.440

$1.040

$0.750

$0.683

Verical

USA . 1,732 parts In-Stock

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$0.261

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$0.261

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Chip1Stop

Japan . 1,732 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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$0.624

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50

$0.624

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Vyrian

USA . 1,917 parts In-Stock

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Ampacity Inc.

Singapore . 1,784 parts In-Stock

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$0.043

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$0.043

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Semicontronic

India . 1,747 parts In-Stock

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$0.043

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$0.042

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$0.042

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$0.042

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Argo Parts USA

USA . 3,281 parts In-Stock

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$0.624

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$0.606

3,281

$0.624

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$0.606

Continental Prestige Electronics

USA . 2,316 parts In-Stock

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$0.624

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$0.612

2,316

$0.624

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$0.612

Netroflash

USA . 1,000 parts In-Stock

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$0.624

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$0.624

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Corohmni

South Africa . 863 parts In-Stock

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$0.626

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$0.626

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Aztec Data Supply Inc.

USA . 2,723 parts In-Stock

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$1.550

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$1.550

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Microchip USA

USA . 8,194 parts In-Stock

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$4.497

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$4.497

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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Overview

Discover the power of efficiency with the SIHD6N62E-GE3 by Vishay Intertechnology. Crafted with precision and quality in mind, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a maximum DS Breakdown Voltage of 620V and a Maximum Drain Current of 6A, this transistor is designed to handle your toughest tasks with ease. Experience the benefits of enhanced mode operation and a built-in diode for added convenience. Trust Vishay Intertechnology to deliver reliable solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring the transistor's reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency, making them suitable for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and allows for more efficient operation in certain applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high currents with low resistance for efficient power control.

Surface Mount: YES

Being surface mount compatible makes this FET easier to integrate into circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 620 V

With a high breakdown voltage, this FET can handle high voltage applications safely and reliably.

Maximum Pulsed Drain Current (IDM): 12 A

The high pulsed drain current rating allows this FET to handle sudden spikes in current without overheating.

Maximum Power Dissipation (Abs): 78 W

With a high power dissipation rating, this FET can handle significant power loads without overheating or failing.

Maximum Operating Temperature: 150 °C

The high operating temperature rating ensures the FET can perform reliably in a wide range of environments and applications.

Technical Specifications

Power Field Effect Transistors (FET) SIHD6N62E-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

88 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SIHD6N62E-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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