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SI7922DN-T1-E3

Vishay Intertechnology

SI7922DN-T1-E3 by Vishay Intertechnology

Vishay Intertechnology SI7922DN-T1-E3 is a N-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 10A IDM, 1.25mJ EAS, and 0.195ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max temp of 150°C and package style of SMALL OUTLINE.

Median Price

$0.862

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,285 parts In-Stock

1+ parts

$1.700

100+ parts

$1.123

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$0.806

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1,285

$1.700

$1.123

$0.806

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Future Electronics

Canada . 3,000 parts In-Stock

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$0.715

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$0.715

Verical

USA . 3,000 parts In-Stock

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$1.008

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Mouser Electronics

USA . 689 parts In-Stock

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$0.712

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$0.712

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Forefront Electronics and Design

USA . 13 parts In-Stock

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$4.900

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Vyrian

USA . 1,938 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,087 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Bristol Electronics

USA . 145 parts In-Stock

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145

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Flex Direct, LLC

USA . 145 parts In-Stock

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145

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Distributors (Availability)

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Semicontronic

India . 1,931 parts In-Stock

1+ parts

$0.610

100+ parts

$0.595

1k+ parts

$0.592

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1,931

$0.610

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$0.592

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Ampacity Inc.

Singapore . 1,870 parts In-Stock

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$0.610

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1,870

$0.610

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Aztec Data Supply Inc.

USA . 4,716 parts In-Stock

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$0.950

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4,716

$0.950

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$1.286

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$1.222

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$1.222

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$1.286

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$1.222

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Corohmni

South Africa . 15 parts In-Stock

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$1.365

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Component Stockers USA

USA . 7,592 parts In-Stock

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$1.490

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$1.100

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$0.790

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7,592

$1.490

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Microchip USA

USA . 8,692 parts In-Stock

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$5.252

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8,692

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Bastille Electronics

Australia . 4,554 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,511 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

USA . 1,884 parts In-Stock

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ChipstoGo Electronic ltd

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Argo Parts USA

USA . 1,098 parts In-Stock

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Overview

Unlock the power of efficient switching with the Vishay Intertechnology SI7922DN-T1-E3 Power Field Effect Transistor. Designed for reliability and performance, this N-CHANNEL FET boasts a separate configuration with built-in diode elements, making it ideal for a variety of applications. From industrial machinery to consumer electronics, this enhancement mode transistor offers a maximum drain-source on resistance of 0.195 ohm and a minimum DS breakdown voltage of 100V, ensuring optimal functionality in any project. Trust Vishay Intertechnology for quality components that deliver value and performance every time.

Feature Benefit Bullets

Polarity: N-CHANNEL

Suitable for low-side switching applications, providing efficient control over the flow of current.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Offers versatility in circuit design with built-in diode for protection against reverse currents.

Transistor Application: SWITCHING

Ideal for applications requiring fast switching speeds and efficient power management.

Surface Mount: YES

Enables easy and compact PCB design, saving space in the circuit layout.

Minimum DS Breakdown Voltage: 100 V

Provides a high level of voltage protection, ensuring reliable performance in high-power circuits.

Package Shape: SQUARE

Allows for easy placement and alignment on the PCB, facilitating efficient assembly.

Terminal Form: C BEND

Enhances solder joint reliability for improved durability in various operating conditions.

Operating Mode: ENHANCEMENT MODE

Offers precise control over the transistor's conductivity, enhancing overall performance efficiency.

No. of Elements: 2

Provides dual-channel functionality for increased flexibility in circuit design.

Maximum Pulsed Drain Current (IDM): 10 A

Capable of handling high peak currents efficiently, suitable for demanding applications.

Avalanche Energy Rating (EAS): 1.25 mJ

Offers protection against voltage spikes and transient overvoltage conditions.

Maximum Drain Current (Abs) (ID): 1.8 A

Supports continuous current flow within the specified limits for reliable operation.

No. of Terminals: 6

Provides multiple connection points for versatile integration into the circuit.

Maximum Power Dissipation (Abs): 2.6 W

Ensures efficient heat dissipation, contributing to the overall reliability of the transistor.

Package Style (Meter): SMALL OUTLINE

Compact form factor ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and reliability in power switching applications.

Maximum Operating Temperature: 150 °C

Able to operate effectively within a wide temperature range, suitable for various environments.

Transistor Element Material: SILICON

Provides stable performance characteristics and high efficiency in power management.

Terminal Finish: MATTE TIN

Ensures good solder joint quality and corrosion resistance for long-term reliability.

Maximum Drain-Source On Resistance: 0.195 ohm

Low ON resistance for minimal power loss and efficient performance.

Terminal Position: DUAL

Facilitates easy connection and integration into the circuit layout.

Case Connection: DRAIN

Provides a secure and reliable connection point for efficient current flow.

Maximum Time At Peak Reflow Temperature (s): 30

Resistant to extended exposure to high temperatures during soldering processes.

Peak Reflow Temperature °C: 260

Able to withstand high-temperature reflow soldering processes, ensuring robust assembly.

Technical Specifications

Power Field Effect Transistors (FET) SI7922DN-T1-E3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

1.25 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

1.8 A

Maximum Drain Current (ID):

1.8 A

Maximum Drain-Source On Resistance:

.195 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-C6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI7922DN-T1-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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