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SI7998DP-T1-GE3

Vishay Intertechnology

SI7998DP-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SI7998DP-T1-GE3 is an N-channel Power FET with 30V DS breakdown voltage and 60A max pulsed drain current. Ideal for switching applications, it features a separate configuration with built-in diode, 0.0093 ohm max RDS(on), and operates in enhancement mode.

Median Price

$0.780

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,776 parts In-Stock

1+ parts

$0.670

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-

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1,776

$0.670

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DigiKey

USA . 5,665 parts In-Stock

1+ parts

$2.140

100+ parts

$0.926

1k+ parts

$0.704

10k+ parts

$0.575

5,665

$2.140

$0.926

$0.704

$0.575

Element14

Singapore . 13,865 parts In-Stock

1+ parts

$2.220

100+ parts

$1.420

1k+ parts

$0.960

10k+ parts

$0.941

13,865

$2.220

$1.420

$0.960

$0.941

Newark

USA . 2,763 parts In-Stock

1+ parts

$2.740

100+ parts

$1.310

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$1.080

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-

2,763

$2.740

$1.310

$1.080

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Farnell

UK . 13,865 parts In-Stock

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-

100+ parts

$0.780

1k+ parts

$0.526

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$0.515

13,865

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$0.780

$0.526

$0.515

Arrow

USA . 12,000 parts In-Stock

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$0.584

12,000

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$0.584

Verical

USA . 12,000 parts In-Stock

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$0.584

12,000

-

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$0.584

Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$0.739

100+ parts

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750

$0.739

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NAC Semi

USA . 9,000 parts In-Stock

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$0.814

9,000

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$0.814

Vyrian

USA . 8,742 parts In-Stock

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8,742

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Chip Stock

USA . 4,600 parts In-Stock

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4,600

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,805 parts In-Stock

1+ parts

$0.490

100+ parts

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8,805

$0.490

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Argo Parts USA

USA . 1,587 parts In-Stock

1+ parts

$0.739

100+ parts

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1,587

$0.739

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.739

100+ parts

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1,000

$0.739

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Continental Prestige Electronics

USA . 847 parts In-Stock

1+ parts

$0.739

100+ parts

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$0.724

847

$0.739

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-

$0.724

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$0.754

100+ parts

$0.754

1k+ parts

$0.754

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870

$0.754

$0.754

$0.754

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Semicontronic

India . 8,475 parts In-Stock

1+ parts

$1.070

100+ parts

$1.043

1k+ parts

$1.038

10k+ parts

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8,475

$1.070

$1.043

$1.038

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Modulus Dynamics

Lithuania . 13,204 parts In-Stock

1+ parts

$1.153

100+ parts

$1.153

1k+ parts

$1.153

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13,204

$1.153

$1.153

$1.153

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Corohmni

South Africa . 163 parts In-Stock

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$1.482

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163

$1.482

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Aztec Data Supply Inc.

USA . 3,268 parts In-Stock

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$1.700

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3,268

$1.700

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Microchip USA

USA . 3,121 parts In-Stock

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$4.395

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3,121

$4.395

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iodParts Technologies Inc.

India . 18,000 parts In-Stock

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Robosynatics

Brazil . 3,318 parts In-Stock

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3,318

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Lucentia Tech

USA . 3,318 parts In-Stock

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100+ parts

$1.731

1k+ parts

$1.695

10k+ parts

$1.695

3,318

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$1.731

$1.695

$1.695

Assy Fe

Spain . 3,000 parts In-Stock

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Kepictronics

USA . 2,931 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,807 parts In-Stock

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2,807

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Overview

Upgrade your power switching applications with Vishay Intertechnology's SI7998DP-T1-GE3 N-CHANNEL Power Field Effect Transistor. This high-quality component features a separate configuration with built-in diodes, allowing for efficient performance and reliability in various electronic systems. From consumer electronics to industrial machinery, this transistor is designed to deliver exceptional value, benefits, and advantages to customers seeking superior power management solutions. Trust Vishay Intertechnology for cutting-edge technology and unmatched quality in every component.

Feature Benefit Bullets

Polarity: N-CHANNEL

- N-channel FETs are commonly used for high-power applications due to their superior performance and lower resistance.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

- Features two separate elements with built-in diode, providing versatile functionality for switching applications.

Transistor Application: SWITCHING

- Ideal for high-speed switching applications due to its fast response time and low power dissipation.

Surface Mount: YES

- Surface mount design allows for easy integration onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 30 V

- With a minimum breakdown voltage of 30V, this FET can handle higher voltage loads with ease.

Package Shape: RECTANGULAR

- Rectangular shape offers efficient use of space and enables easy placement on circuit boards.

Terminal Form: C BEND

- C bend terminal form provides secure connections and helps minimize signal loss.

Operating Mode: ENHANCEMENT MODE

- Enhancement mode operation allows for simple control of the power flow, making it ideal for various applications.

No. of Elements: 2

- Incorporating two elements provides redundancy and increased reliability in the circuit.

Maximum Pulsed Drain Current (IDM): 60 A

- With a high pulsed drain current, this FET can handle large current spikes without overheating.

Maximum Drain Current (Abs) (ID): 30 A

- Able to sustain a continuous drain current of 30A, making it suitable for high-power applications.

No. of Terminals: 6

- Six terminals provide multiple connection points and flexibility in circuit design.

Maximum Power Dissipation (Abs): 40 W

- Capable of dissipating up to 40W of power, ensuring stability under high load conditions.

Package Style (Meter): SMALL OUTLINE

- Small outline package style offers compact size and optimal thermal performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

- Utilizes metal-oxide semiconductor technology for improved performance and reliability.

Maximum Operating Temperature: 150 °C

- With a maximum operating temperature of 150°C, this FET can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

- Silicon material provides high conductivity and durability for long-lasting performance.

Terminal Finish: MATTE TIN

- Matte tin finish offers corrosion resistance and ensures reliable connections.

Maximum Drain-Source On Resistance: 0.0093 ohm

- Low drain-source on resistance reduces power loss and improves efficiency in the circuit.

Terminal Position: DUAL

- Dual terminal position allows for versatile mounting options and ease of connection.

Case Connection: DRAIN

- Drain case connection ensures efficient heat dissipation and reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) SI7998DP-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.0093 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI7998DP-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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