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SI3900DV

Vishay Intertechnology

SI3900DV by Vishay Intertechnology

Vishay Intertechnology's SI3900DV is a N-CHANNEL FET with 2 elements & built-in diode. It has a max drain current of 2A, on-resistance of 0.125 ohm, and operates in enhancement mode. Ideal for applications requiring small outline packages, such as power management circuits in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 11,500 parts In-Stock

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11,500

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Vyrian

USA . 1,243 parts In-Stock

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1,243

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,952 parts In-Stock

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$0.945

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1,952

$0.945

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Corohmni

South Africa . 194 parts In-Stock

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$1.423

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194

$1.423

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AZTECH Wire

Italy . 698 parts In-Stock

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$10.015

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698

$10.015

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Continental Prestige Electronics

USA . 6,502 parts In-Stock

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6,502

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iodParts Technologies Inc.

India . 3,460 parts In-Stock

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3,460

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Argo Parts USA

USA . 3,047 parts In-Stock

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3,047

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unleash the power of cutting-edge technology with the Vishay Intertechnology SI3900DV Small Signal Field Effect Transistor. Designed with precision and quality in mind, this transistor offers reliability and performance like no other. Perfect for a wide range of applications, from consumer electronics to industrial equipment, this N-channel transistor is a game-changer in the world of semiconductor technology. Experience the value and benefits that Vishay Intertechnology brings to the table and take your projects to new heights with the SI3900DV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, making the product suitable for portable applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have higher mobility electrons, lower resistance, and better performance compared to P-Channel FETs.

Minimum DS Breakdown Voltage: 20 V

The higher breakdown voltage provides better protection against voltage spikes, making the product suitable for various applications where reliability is crucial.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space and easy integration into existing designs.

Maximum Drain Current (Abs) (ID): 2 A

The high maximum drain current rating of 2A allows the product to handle higher loads without overheating or malfunctioning.

Maximum Power Dissipation (Abs): 0.83 W

With a maximum power dissipation of 0.83W, the product can operate efficiently without risking damage due to excess heat.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high input impedance, low leakage current, and high speed operation, making the FET ideal for switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for reliable operation in harsh environments where temperature fluctuations may occur.

Transistor Element Material: SILICON

Silicon-based transistors offer good thermal conductivity, low cost, and are widely available, making them a popular choice for various electronic applications.

Maximum Drain-Source On Resistance: 0.125 ohm

The low drain-source on resistance of 0.125 ohms results in minimal power loss and improved efficiency in the product's operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) SI3900DV attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

SI3900DV Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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