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SI1012X-T1-GE3

Vishay Intertechnology

SI1012X-T1-GE3 by Vishay Intertechnology

SI1012X-T1-GE3 by Vishay Intertechnology is a N-channel FET with 20V DS breakdown voltage and 0.5A max drain current. Ideal for switching applications, it operates in enhancement mode with 0.7 ohm RDS(on) and 150°C max temp. Perfect for compact designs due to small outline package style and flat terminal form.

Median Price

$0.156

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

$0.256

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10

$0.256

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Mouser Electronics

USA . 15,052 parts In-Stock

1+ parts

$0.430

100+ parts

$0.255

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$0.172

10k+ parts

$0.143

15,052

$0.430

$0.255

$0.172

$0.143

DigiKey

USA . 10 parts In-Stock

1+ parts

$0.700

100+ parts

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$0.141

10

$0.700

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$0.141

TTI

USA . 15,000 parts In-Stock

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$0.137

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$0.137

Avnet

USA . 3,000 parts In-Stock

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$0.156

3,000

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$0.156

Verical

USA . 110 parts In-Stock

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$0.148

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110

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$0.148

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Chip1Stop

Japan . 110 parts In-Stock

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$0.148

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110

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$0.148

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Distributors (In-Stock)

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Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$0.208

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72

$0.208

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Chip Stock

USA . 112,500 parts In-Stock

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112,500

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Vyrian

USA . 4,425 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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Bristol Electronics

USA . 140 parts In-Stock

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140

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Ampacity Inc.

Singapore . 4,395 parts In-Stock

1+ parts

$0.253

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4,395

$0.253

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Perfect Parts

USA . 66,192 parts In-Stock

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66,192

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Kepictronics

USA . 36,000 parts In-Stock

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36,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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iodParts Technologies Inc.

India . 3,205 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$0.204

1k+ parts

$0.197

10k+ parts

$0.193

1,000

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$0.204

$0.197

$0.193

Cyclops Electronics Ltd (Excess)

UK . 582 parts In-Stock

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582

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Overview

Discover the power of Vishay Intertechnology's SI1012X-T1-GE3 Small Signal Field Effect Transistor. With high-quality manufacturing and a range of applications in switching technology, this N-channel transistor offers unparalleled performance and reliability. Enhance your electronic projects with its built-in diode and low on-resistance, providing efficient operation and maximum power dissipation. Take your designs to the next level with Vishay Intertechnology's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good physical protection for the transistor, making it more durable and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics such as higher gain and lower on-state resistance compared to P-channel transistors, making them suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more flexibility in circuit design and can protect the transistor from reverse voltage spikes.

Transistor Application: SWITCHING

This transistor is specifically designed for switching applications, providing fast switching speeds and low power dissipation.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, making it ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20 V allows for the transistor to handle higher voltages without damaging the device.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized design for easy integration into various circuit layouts and mounting configurations.

Terminal Form: FLAT

The flat terminal form simplifies the soldering process and ensures a secure connection to the PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the flow of current, making them suitable for applications where precise regulation is required.

Maximum Drain Current (Abs) (ID): 0.5 A

With a maximum drain current of 0.5 A, this transistor can handle moderate current loads effectively.

No. of Terminals: 3

Having 3 terminals allows for flexibility in circuit design and enables easy connection to external components.

Maximum Power Dissipation (Abs): 0.275 W

The low maximum power dissipation ensures that the transistor operates efficiently and does not overheat during prolonged use.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and contributes to a compact overall design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this transistor suitable for demanding applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments without compromising performance.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its excellent electrical properties and reliability, ensuring optimal transistor performance.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and ensures a reliable connection between the transistor terminals and the PCB.

Maximum Drain-Source On Resistance: 0.7 ohm

The low drain-source on resistance of 0.7 ohms minimizes power loss and improves the efficiency of the transistor in switching applications.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit layout and enables easy connection to external components.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this transistor can withstand the soldering process without damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable connections during the manufacturing process.

Technical Specifications

Small Signal Field Effect Transistors (FET) SI1012X-T1-GE3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Additional Features:

LOW THRESHOLD

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.5 A

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI1012X-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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