Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Toshiba's TC551001CF-70L is a 128Kx8 SRAM with 70ns access time, operating at 5V. It features a small outline package and common I/O type, suitable for commercial temperature grade applications requiring fast and reliable memory storage.
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This material ensures durability and reliability, making the product suitable for various operating conditions.
Allows for flexible and independent operation, enhancing the overall performance of the product.
Stable supply voltage ensures consistent and reliable functionality of the product.
Sufficient number of terminals for connectivity and integration with other components.
Compact size allows for space-saving and easy integration into various systems.
Wide operating temperature range makes the product suitable for diverse environments.
Suitable width for efficient data processing and storage capabilities.
CMOS technology offers low power consumption and high speed performance, enhancing the overall efficiency of the product.
Fast access time ensures quick data retrieval and processing, making the product ideal for high-performance applications.
SRAM TC551001CF-70L attributes and parameters. Explore more SRAM devices from Toshiba
Maximum Access Time:
Input/Output Type:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Ports:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
TC551001CF-70L Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Good-ark Electronics
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
LM317T
Linear Technology
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Operating Temperature (TJ-Min): 0 Cel; No. of Functions: 1; JESD-609 Code: e0;
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
Taitron Components
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
71321SA55JG8
Integrated Device Technology
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
AS7C34096A-10TIN
Alliance Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
CY14V116N-BZ30XIT
Infineon Technologies
Infineon's CY14V116N-BZ30XIT is a 1MX16 SRAM with 30ns access time, operating at 3V. It features a low profile grid array package and CMOS technology. Ideal for industrial applications requiring fast, non-volatile memory with 16-bit width.
CY14B108L-ZS45XIT
Cypress Semiconductor
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
71256SA15TPG
Renesas Electronics
STANDARD SRAM; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
CY7C1041DV33-10BVXIT
CY7C1041DV33-10BVXIT by Cypress is a 256Kx16 SRAM with 10ns access time, operating at 3.3V. It features a very thin profile grid array package and offers common I/O type for industrial applications. With a max temperature of 85°C, it is ideal for high-performance parallel memory systems.
23K256T-I/SN
Microchip Technology
23K256T-I/SN by Microchip Technology is a 32Kx8 SRAM with 20MHz clock frequency, operating at 3V. It features synchronous operation, separate I/O type, and 3-STATE output characteristics. Ideal for industrial applications requiring high-speed memory access in a small outline package.
CY62177EV30LL-55BAXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
CY7C1041GN30-10BVXIT
CY7C1041GN30-10BVXIT by Infineon: 256Kx16 SRAM with 10ns access time, operates at -40 to 85°C. Ideal for industrial applications requiring fast and reliable parallel memory storage. Package style: grid array, very thin profile, fine pitch.
5962-9461110HMA
White Microelectronics
SRAM MODULE; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFP; Package Shape: SQUARE; Memory Density: 16777216 bit;
DS1225Y-200IND
Maxim Integrated
DS1225Y-200IND by Maxim Integrated is an 8Kx8 SRAM with 65536-bit memory density. It operates at 5V, has a max access time of 200ns, and consumes up to 85mA. Ideal for industrial applications requiring non-volatile memory storage in microelectronic assemblies.
71024S20TYGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
CY14E256LA-SZ45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
5962-8855206YA
Micross Components
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Technology: CMOS;
AS6C8016-55ZIN
Alliance Memory
Alliance Memory's AS6C8016-55ZIN is a 512Kx16 SRAM with 55ns access time, operating at 3V. Ideal for industrial applications, it features a small outline package and common I/O type. With a max supply voltage of 5.5V, this CMOS technology memory IC offers high performance in a compact form factor.
71321LA20PFG8
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
5962-8685908LA
Pyramid Semiconductor
OTHER SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
IDT7130LA100CB
The Renesas Electronics IDT7130LA100CB is a MIL-PRF-38535 screened SRAM with 1KX8 organization, operating at 5V. It features an asynchronous mode, 3-STATE output characteristics, and common I/O type. Ideal for military applications due to its ceramic-metal package and wide temperature range of -55 to 125°C.
CAT24C44VI-G
Catalyst Semiconductor
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
71V416S10PHGI8
Renesas Electronics' 71V416S10PHGI8 is a 256Kx16 SRAM with 10ns max access time, operating at 3.3V. Ideal for industrial applications, it features a small outline package with dual terminals and Gull Wing form factor. This CMOS technology memory chip has a parallel interface and offers high performance in a compact design.
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TC551001BFL-70L
Toshiba
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
TC551001BFL-70
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TC55257DFI-85L
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
TC55VBM316AFTN55
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TC551001APL-70
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
TC551001APL-70L
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
TC551001BPL-70L
TC5588P-20
CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.45 mm;
TC551001BFL-85L
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
TC551001CFI-70L
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
TC551001CP-85L
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
TC551001PL-85
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 85 ns;
TC551402J-25
CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Maximum Standby Current: .01 Amp;
TC5514AP-3
STANDARD SRAM; Temperature Grade: OTHER; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
TC5517APL-2
STANDARD SRAM; Temperature Grade: OTHER; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .000001 Amp;
TC55257BSPL-10L
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns;
TC55257DFI-70V
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
TC55257DFTI-85V
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: TSOP1; Package Shape: RECTANGULAR; No. of Words Code: 32K;
TC55V1001AF-85
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
Supply Digital Components
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