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DP83865DVH

Texas Instruments

DP83865DVH by Texas Instruments

DP83865DVH by Texas Instruments is an Ethernet transceiver IC with a data rate of 1000 Mbps. It operates at a supply voltage of 1.8V and has a terminal pitch of 0.5mm. This network interface chip is designed for commercial temperature grade applications.

Median Price

$25.640

Lifecycle Status

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Arrow

USA . 25 parts In-Stock

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$25.640

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$24.260

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$24.250

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Verical

USA . 25 parts In-Stock

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$25.640

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$24.260

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Chip1Stop

Japan . 25 parts In-Stock

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Digiode

USA . 2,285 parts In-Stock

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Nova Conductors

Japan . 35 parts In-Stock

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Vyrian

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Anansix

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Semtec, LLC

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Speed Components Ltd

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Prism Electronics

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ComSIT Distribution GmbH

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R&J Components

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Bristol Electronics

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Electronics Depot

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Sensible Micro Corp

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Inventory MP

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PC Components Company LLC

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Distributors (Availability)

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Parana Technologies

USA . 1,175 parts In-Stock

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$7.013

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$7.570

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$7.013

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DigiPath Technology Company

USA . 2,320 parts In-Stock

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$7.722

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$7.722

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IDEA Electronic Components Group

UK . 1,734 parts In-Stock

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$7.880

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$7.092

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ChromeModa Solutions

Germany . 50 parts In-Stock

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$7.880

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$6.462

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AZTECH Wire

Italy . 364 parts In-Stock

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$18.286

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Ampacity Inc.

Singapore . 25 parts In-Stock

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$21.790

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Semicontronic

India . 25 parts In-Stock

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$21.790

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$21.245

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Corphita

USA . 310 parts In-Stock

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Continental Prestige Electronics

USA . 3,184 parts In-Stock

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$27.390

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Netroflash

USA . 2,000 parts In-Stock

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$27.390

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$26.842

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Corohmni

South Africa . 1,018 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$28.776

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Argo Parts USA

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Lixinc

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Glotronic Ltd.

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Alle Elektronik GmbH

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iodParts Technologies Inc.

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Overview

Experience seamless networking with the Texas Instruments DP83865DVH Ethernet transceiver. Crafted with precision and quality, this network interface device is designed to excel in various applications, delivering reliable performance and high-speed data rates of up to 1000 Mbps. With a compact rectangular shape and surface mount capability, this Ethernet transceiver is versatile and easy to integrate into your system. Trust in Texas Instruments for cutting-edge technology that enhances connectivity and efficiency, making the DP83865DVH the ideal choice for all your networking needs. Upgrade your network today and enjoy the benefits of superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability for the network interface, ensuring a long lifespan.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various systems and devices.

Power Supplies (V): 1.8, 2.5/3.3

Support for multiple power supply voltages provides flexibility and compatibility with different power systems.

No. of Terminals: 128

With 128 terminals, this network interface offers a high level of connectivity for efficient data transfer.

Package Style (Meter): FLATPACK, FINE PITCH

The flatpack and fine pitch package styles help in minimizing space requirements and improving overall design aesthetics.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish helps in soldering and ensures good electrical conductivity for optimal performance.

Terminal Position: QUAD

Quad terminal positioning enables stable connection and efficient data transmission.

Maximum Seated Height: 3.15 mm

The low seated height helps in installation in compact spaces without compromising performance.

Width: 14 mm

Compact width ensures compatibility with various device designs and layouts.

Peak Reflow Temperature °C: 245

High peak reflow temperature supports robust soldering processes for secure connections.

Length: 20 mm

Moderate length provides a balanced form factor for easy integration and installation.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures suitability for standard operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance for efficient data processing.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during installation.

Telecom IC Type: ETHERNET TRANSCEIVER

Ethernet transceiver type enables seamless communication and data exchange over networks.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent power delivery for reliable operation.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for compact design and high density of connections.

Data Rate: 1000 Mbps

High data rate of 1000 Mbps supports fast and efficient data transfer speeds for network communication.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, suitable for standard operating conditions.

Technical Specifications

Network Interfaces DP83865DVH attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1000 Mbps

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e0

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.67X.93,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.15 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

DP83865DVH Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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