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CD74HC08M96

Texas Instruments

CD74HC08M96 by Texas Instruments

CD74HC08M96 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 27 ns at 5V, making it suitable for high-speed applications. With a small outline package style and military temperature grade, it is ideal for compact and rugged electronic systems.

Median Price

$0.345

Lifecycle Status

Suppliers In-Stock

26

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1k+

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Texas Instruments

USA . 391,456 parts In-Stock

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Chip1Stop

Japan . 1,516 parts In-Stock

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Arrow

USA . 1,158 parts In-Stock

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$0.156

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Mouser Electronics

USA . 12,789 parts In-Stock

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DigiKey

USA . 7,332 parts In-Stock

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Verical

USA . 1,158 parts In-Stock

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Rochester

USA . 444 parts In-Stock

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RS (Exports)

UK . 290 parts In-Stock

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$0.299

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Distributors (In-Stock)

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Digiode

USA . 2,342 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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TME

Poland . 523 parts In-Stock

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Component Electronics Inc.

Canada . 2,226 parts In-Stock

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$0.920

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Vyrian

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Chip Stock

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Prism Electronics

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Cyclops Electronics Ltd

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Atlantic Semiconductor

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Sea View Technologies

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A2Z Electronics, Inc.

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Microfarads

USA . 2,157 parts In-Stock

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Bristol Electronics

USA . 2,083 parts In-Stock

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Martec Srl

Italy . 788 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Electronic Expediters

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North Shore Components

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Semicontronic

India . 51,194 parts In-Stock

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Ampacity Inc.

Singapore . 50,943 parts In-Stock

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Corphita

USA . 3,199 parts In-Stock

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Argo Parts USA

USA . 3,521 parts In-Stock

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Continental Prestige Electronics

USA . 1,151 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Microchip USA

USA . 8,168 parts In-Stock

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$1.038

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Parana Technologies

USA . 2,086 parts In-Stock

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$15.377

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$15.764

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DigiPath Technology Company

USA . 51 parts In-Stock

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$16.931

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$15.577

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$15.577

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

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$17.277

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$16.413

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$15.549

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$17.277

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ChromeModa Solutions

Germany . 475 parts In-Stock

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$17.277

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$14.167

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Corohmni

South Africa . 989 parts In-Stock

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$17.416

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 4,827 parts In-Stock

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Lixinc

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Glotronic Ltd.

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Alle Elektronik GmbH

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Kepictronics

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GreenTree Electronics

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Cyclops Electronics Ltd (Excess)

UK . 667 parts In-Stock

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Supply Digital

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Overview

Unlock the power of precision and reliability with the CD74HC08M96 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality logic gates that are essential for various applications. This versatile product offers exceptional value, boasting fast propagation delay, low power consumption, and a wide operating temperature range. Whether you're designing consumer electronics or industrial machinery, the CD74HC08M96 provides unmatched performance and efficiency. Elevate your projects with the trusted quality and superior technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 27 ns

With a fast propagation delay, this product ensures quick and efficient operation in logic circuits.

Surface Mount: YES

Being surface mountable, this product offers easy and secure installation on circuit boards, saving space and facilitating mass production.

No. of Functions: 4

With multiple functions available in one component, this product reduces the need for additional logic gates, simplifying circuit design.

No. of Inputs: 2

The two-input design of this product allows for versatile logic operations and compatibility with a wide range of applications.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard 5V supply voltage, this product is compatible with most common electronic systems and devices.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product ensures minimal interference and distortion in signal transmission.

Power Supplies (V): 2/6

Compatible with both 2V and 6V power supplies, this product offers flexibility in various voltage applications.

No. of Terminals: 14

The 14 terminal design of this product provides ample connection points for integrating into complex circuit layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this product ensures space-saving and efficient PCB layout.

Maximum I (ol): 5.2 Amp

With a high maximum output current, this product can drive multiple loads without compromising performance.

Propagation Delay (tpd): 135 ns

Although not the fastest, the propagation delay of 135 ns ensures reliable and stable logic operations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for use in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 to 125°C ensures reliable performance in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, extending the product's lifespan.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options, allowing for versatile integration into different circuit configurations.

Maximum Seated Height: 1.75 mm

With a low seated height, this product is ideal for applications with strict space constraints.

Width: 3.9 mm

The compact width of 3.9 mm makes this product suitable for use in compact electronic devices and systems.

Minimum Supply Voltage (Vsup): 2V

Operating at a minimum supply voltage of 2V, this product offers energy-efficient performance in low-power applications.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this product can withstand the reflow soldering process during assembly.

Length: 8.65 mm

The moderate length of 8.65 mm provides a balance between compactness and ease of handling during installation.

Temperature Grade: MILITARY

Designed for military-grade applications, this product offers robust performance and reliability in demanding environments.

Technology: CMOS

Built using CMOS technology, this product delivers high-speed operation, low power consumption, and noise immunity, making it an ideal choice for digital logic circuits.

Terminal Form: GULL WING

The gull wing terminal form ensures secure soldering connections and easy handling during assembly.

Packing Method: TR

The TR packing method provides secure packaging and protection during storage and transportation.

Terminal Pitch: 1.27 mm

With a standard terminal pitch of 1.27 mm, this product offers compatibility with common PCB designs and layouts.

Maximum Supply Voltage (Vsup): 6V

With a maximum supply voltage of 6V, this product can handle higher voltage requirements in various electronic systems.

Maximum Power Supply Current (ICC): 0.04 mA

With a low maximum power supply current, this product offers energy-efficient performance and minimizes power consumption.

Technical Specifications

Logic Gates CD74HC08M96 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC08M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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