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V62/18617-01XE

Texas Instruments

V62/18617-01XE by Texas Instruments

V62/18617-01XE by Texas Instruments is a Line Transceiver with 8 terminals, operating at 3.3V nominal voltage. It features differential output and Schmitt trigger input characteristics, suitable for ISO 11898-2 interface standard applications. With a MILITARY temperature grade, it offers fast transmission with max transmit delay of 1200ns and receive delay of 105ns.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,197 parts In-Stock

1+ parts

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8,197

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Digiode

USA . 3,656 parts In-Stock

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3,656

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 575 parts In-Stock

1+ parts

$11.251

100+ parts

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575

$11.251

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Parana Technologies

USA . 1,708 parts In-Stock

1+ parts

$12.270

100+ parts

-

1k+ parts

$12.693

10k+ parts

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1,708

$12.270

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$12.693

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ChromeModa Solutions

Germany . 6,254 parts In-Stock

1+ parts

$13.786

100+ parts

$11.305

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6,254

$13.786

$11.305

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IDEA Electronic Components Group

UK . 508 parts In-Stock

1+ parts

$13.786

100+ parts

$13.097

1k+ parts

$12.407

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508

$13.786

$13.097

$12.407

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One Stop Electronics

USA . 539 parts In-Stock

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$30.500

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539

$30.500

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Corphita

USA . 1,892 parts In-Stock

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1,892

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DigiPath Technology Company

USA . 1,842 parts In-Stock

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$12.429

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1,842

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$12.429

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Overview

Enhance your communication systems with the V62/18617-01XE by Texas Instruments, a top-of-the-line line driver & receiver designed for superior performance and reliability. With a focus on quality and precision, Texas Instruments has crafted this product to exceed industry standards. Ideal for a wide range of applications, this product offers seamless integration, enhanced efficiency, and unmatched durability. Experience the value and benefits of this cutting-edge technology, providing you with a competitive edge in the market. Elevate your projects with the V62/18617-01XE and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage ensures compatibility with a wide range of power sources and operating conditions.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of board space and easier integration into existing PCB layouts.

Maximum Transmit Delay: 1200 ns

Low transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed communication applications.

No. of Terminals: 8

Having 8 terminals provides flexibility for connecting to various components and peripherals in the system.

Minimum Operating Temperature: -55 °C

Wide minimum operating temperature range allows for reliable performance in extreme environmental conditions.

Interface Standard: ISO 11898-2

Compliance with ISO standard ensures interoperability and compatibility with other devices and systems following the same standard.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage facilitates consistent and reliable operation of the product within the specified voltage range.

Technical Specifications

Line Drivers & Receivers V62/18617-01XE attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

ISO 11898-2

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

105 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Total Dose (V):

20k Rad(Si)

Maximum Transmit Delay:

1200 ns

Width:

3.895 mm

Trade Compliance

V62/18617-01XE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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