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V62/18617-01XE-T

Texas Instruments

V62/18617-01XE-T by Texas Instruments

V62/18617-01XE-T by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at -55 to 125 °C. It features a max transmit delay of 1200 ns and differential output for ISO 11898-2 interface standard applications. This small outline package has a MILITARY temperature grade and nickel palladium gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,897 parts In-Stock

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5,897

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Digiode

USA . 3,009 parts In-Stock

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3,009

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Distributors (Availability)

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Parana Technologies

USA . 2,299 parts In-Stock

1+ parts

$12.378

100+ parts

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$12.817

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2,299

$12.378

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$12.817

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DigiPath Technology Company

USA . 1,782 parts In-Stock

1+ parts

$13.630

100+ parts

$12.539

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1,782

$13.630

$12.539

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ChromeModa Solutions

Germany . 3,554 parts In-Stock

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$13.908

100+ parts

$11.405

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3,554

$13.908

$11.405

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$13.908

100+ parts

$13.213

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$12.517

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2,182

$13.908

$13.213

$12.517

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AZTECH Wire

Italy . 192 parts In-Stock

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$15.098

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192

$15.098

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One Stop Electronics

USA . 1,280 parts In-Stock

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$45.500

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1,280

$45.500

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,976 parts In-Stock

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3,976

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Overview

Enhance your communication systems with the V62/18617-01XE-T by Texas Instruments, a top-quality line driver & receiver designed for peak performance. With a focus on durability and reliability, Texas Instruments delivers cutting-edge technology perfect for military-grade applications. Ensure seamless data transmission with minimal delay and maximum efficiency. Trust Texas Instruments to provide the best-in-class solutions for your communication needs. Choose the V62/18617-01XE-T today and experience unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into various circuit board designs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can easily handle fluctuations in the power input, making it versatile for different operating conditions.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on a circuit board, optimizing layout and design.

Maximum Transmit Delay: 1200 ns

The low transmit delay ensures fast and efficient signal transmission, ideal for applications requiring quick data transfer.

No. of Terminals: 8

With a sufficient number of terminals, this product offers flexibility in connecting to external devices or components.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows this product to function reliably in extreme environmental conditions, making it suitable for a variety of applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures that this product can withstand the soldering process during assembly without compromising its performance.

Interface Standard: ISO 11898-2

Compliance with this interface standard ensures compatibility and interoperability with other devices and systems following the same protocol, making integration easier.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a commonly used standard in many electronic applications, ensuring compatibility and ease of use in various systems.

Technical Specifications

Line Drivers & Receivers V62/18617-01XE-T attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

ISO 11898-2

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

105 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Total Dose (V):

20k Rad(Si)

Maximum Transmit Delay:

1200 ns

Width:

3.895 mm

Trade Compliance

V62/18617-01XE-T Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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