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UCC383T-3G3

Texas Instruments

UCC383T-3G3 by Texas Instruments

UCC383T-3G3 by Texas Instruments is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 3A. It operates in temperatures ranging from -55 to 150°C, making it suitable for various applications requiring stable voltage regulation in harsh environments. The package style is flange mount with through-hole terminals, providing ease of installation and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,456 parts In-Stock

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Digiode

USA . 599 parts In-Stock

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599

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Parana Technologies

USA . 1,097 parts In-Stock

1+ parts

$2.050

100+ parts

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$2.571

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$2.050

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$2.571

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DigiPath Technology Company

USA . 832 parts In-Stock

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$2.257

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$2.076

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832

$2.257

$2.076

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ChromeModa Solutions

Germany . 4,551 parts In-Stock

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$2.303

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$1.888

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$2.303

$1.888

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IDEA Electronic Components Group

UK . 52 parts In-Stock

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$2.303

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$2.073

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52

$2.303

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$2.073

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AZTECH Wire

Italy . 506 parts In-Stock

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$5.369

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506

$5.369

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One Stop Electronics

USA . 136 parts In-Stock

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$7.500

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136

$7.500

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Ampacity Inc.

Singapore . 1,481 parts In-Stock

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$17.500

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$17.500

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Semicontronic

India . 147 parts In-Stock

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$21.500

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$20.962

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$20.855

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147

$21.500

$20.962

$20.855

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Component Stockers USA

USA . 521 parts In-Stock

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$99.990

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521

$99.990

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Corphita

USA . 2,653 parts In-Stock

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Microchip USA

USA . 431 parts In-Stock

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Corohmni

South Africa . 304 parts In-Stock

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Overview

Enhance your electronics projects with the UCC383T-3G3 by Texas Instruments, a top-notch fixed regulator that delivers exceptional reliability and performance. Crafted by a reputable manufacturer, this LDO regulator is ideal for various applications, providing stable output voltage with minimal dropout. Enjoy the convenience of its fixed adjustability and high accuracy, making it a valuable component in your designs. Upgrade your devices with the UCC383T-3G3 and experience the superior quality and benefits that Texas Instruments products have to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Maximum Dropout Voltage-1: 1 V

With a maximum dropout voltage of only 1V, this LDO regulator ensures minimal power loss, making it highly efficient.

Operating Temperature (TJ-Max): 150 °C

The high maximum operating temperature of 150°C allows this regulator to perform reliably in demanding environments.

Technology: BICMOS

The BICMOS technology used in this regulator offers a good balance between high-speed performance and low power consumption.

Nominal Output Voltage-1: 3.3 V

The stable nominal output voltage of 3.3V ensures consistent power delivery to the connected devices.

Maximum Output Current-1: 3 A

With a maximum output current of 3A, this regulator can power multiple components without any issues.

Technical Specifications

Fixed Regulators - Positive Single Output LDO UCC383T-3G3 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1 V

Nominal Dropout Voltage-1:

.5 V

Maximum Input Voltage Absolute:

9 V

Maximum Input Voltage:

9 V

Minimum Input Voltage:

3.45 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Line Regulation:

.007 %

Maximum Load Regulation:

.015 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

3.58 V

Minimum Output Voltage-1:

3.22 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.1TB

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BICMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Maximum Voltage Tolerance:

Trade Compliance

UCC383T-3G3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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