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UCC381-5DP

Texas Instruments

UCC381-5DP by Texas Instruments

UCC381-5DP by Texas Instruments is a BICMOS technology LDO regulator with 1A output current and 5V nominal output voltage. It has a max dropout voltage of 0.6V, suitable for applications requiring precise voltage regulation in compact designs. With a small outline package style and gull wing terminal form, it is ideal for surface mount PCB layouts in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,540 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,540

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Digiode

USA . 3,541 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,541

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,140 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,140

$0.500

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Semicontronic

India . 1,118 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,118

$1.500

$1.462

$1.455

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Parana Technologies

USA . 1,656 parts In-Stock

1+ parts

$8.303

100+ parts

-

1k+ parts

$8.924

10k+ parts

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1,656

$8.303

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$8.924

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ChromeModa Solutions

Germany . 3,865 parts In-Stock

1+ parts

$9.329

100+ parts

$7.650

1k+ parts

-

10k+ parts

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3,865

$9.329

$7.650

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IDEA Electronic Components Group

UK . 1,981 parts In-Stock

1+ parts

$9.329

100+ parts

$8.863

1k+ parts

$8.396

10k+ parts

-

1,981

$9.329

$8.863

$8.396

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AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$12.803

100+ parts

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732

$12.803

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Corphita

USA . 2,118 parts In-Stock

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2,118

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DigiPath Technology Company

USA . 1,619 parts In-Stock

1+ parts

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100+ parts

$8.411

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1,619

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$8.411

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Corohmni

South Africa . 472 parts In-Stock

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472

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Overview

Elevate your electronic designs with the UCC381-5DP by Texas Instruments, a top-of-the-line fixed regulator that guarantees reliable performance and outstanding quality. Manufactured by a trusted industry leader, this LDO offers unparalleled precision and efficiency for a wide range of applications. From powering sensitive components to maintaining stable voltage levels, this innovative product ensures optimal functionality and long-term durability. Experience the benefits of cutting-edge technology and seamless operation with the UCC381-5DP, delivering value and peace of mind to customers seeking superior solutions for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the regulator.

Maximum Dropout Voltage: 1.6 V

Allows for stable output even when input voltage fluctuates, ensuring consistent performance.

Surface Mount: YES

Easy to install and saves space on the circuit board, making it ideal for compact designs.

Operating Temperature (TJ-Max): 85 °C

Can operate in a wide range of temperatures, making it suitable for various environments.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, resulting in improved performance and efficiency.

Nominal Output Voltage-1: 5 V

Provides a stable output voltage, ensuring reliable power supply to connected components.

Maximum Output Current-1: 1 A

Can deliver high current output, making it suitable for powering a wide range of electronic devices.

Technical Specifications

Fixed Regulators - Positive Single Output LDO UCC381-5DP attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Texas Instruments

Specs

Maximum Dropout Voltage-1:

.6 V

Maximum Input Voltage:

9 V

Minimum Input Voltage:

5.15 V

JESD-30 Code:

R-PDSO-G8

Length:

4.89 mm

Maximum Load Regulation:

.005 %

No. of Functions:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

85 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1 A

Maximum Output Voltage-1:

5.125 V

Minimum Output Voltage-1:

4.875 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

3.9 mm

Trade Compliance

UCC381-5DP Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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