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UCC37323DGNRG4

Texas Instruments

UCC37323DGNRG4 by Texas Instruments

UCC37323DGNRG4 by Texas Instruments is a MOSFET gate driver with 2 functions, operating at 4.5-15V. It features a totem-pole output, 0.04us turn-on time, and 4A peak current limit. Ideal for commercial applications requiring inverted output polarity and standard input characteristics in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,773 parts In-Stock

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Digiode

USA . 3,264 parts In-Stock

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3,264

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Nova Conductors

Japan . 44 parts In-Stock

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44

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Distributors (Availability)

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Parana Technologies

USA . 2,330 parts In-Stock

1+ parts

$6.794

100+ parts

-

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$7.444

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2,330

$6.794

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$7.444

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DigiPath Technology Company

USA . 745 parts In-Stock

1+ parts

$7.481

100+ parts

$6.883

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745

$7.481

$6.883

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ChromeModa Solutions

Germany . 1,862 parts In-Stock

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$7.634

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$6.260

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1,862

$7.634

$6.260

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IDEA Electronic Components Group

UK . 1,752 parts In-Stock

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$7.634

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$6.871

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1,752

$7.634

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$6.871

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Ampacity Inc.

Singapore . 560 parts In-Stock

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$16.500

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560

$16.500

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AZTECH Wire

Italy . 506 parts In-Stock

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$19.271

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$19.271

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One Stop Electronics

USA . 929 parts In-Stock

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$20.500

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929

$20.500

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Corphita

USA . 3,273 parts In-Stock

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Argo Parts USA

USA . 3,239 parts In-Stock

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Continental Prestige Electronics

USA . 1,679 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the UCC37323DGNRG4 MOSFET Gate Driver. This advanced product is designed to provide superior performance in a wide range of applications, offering customers unmatched value and benefits. Whether you're looking for precise control, efficient power management, or reliable operation, this innovative solution delivers on all fronts. Trust Texas Instruments to deliver top-notch technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB mounting, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 15 V

The high maximum supply voltage of 15V provides flexibility and compatibility with a wide range of power supply systems.

No. of Functions: 2

Having multiple functions in one device simplifies circuit design, reduces component count, and can improve overall system efficiency.

Package Shape: SQUARE

The square package shape is commonly used and easy to handle, making it straightforward to integrate into existing designs.

Power Supplies (V): 4.5/15

Supporting power supplies from 4.5V to 15V offers versatility in system design and compatibility with various voltage levels.

No. of Terminals: 8

Having 8 terminals allows for a sufficient number of connections for input, output, power, and ground, ensuring a robust and reliable electrical interface.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The compact and heat-sink compatible package style with a shrink pitch offers efficient thermal management and space-saving benefits in crowded PCB layouts.

Minimum Supply Voltage: 4.5V

The low minimum supply voltage of 4.5V enables operation in low-power scenarios and enhances energy efficiency in the system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the device can withstand elevated temperatures without compromising performance, making it suitable for demanding environmental conditions.

Output Characteristics: TOTEM-POLE

The totem-pole output configuration offers high output current capabilities and improved driving performance, ensuring reliable and efficient operation of connected MOSFETs.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the device to function effectively in cold environments, providing consistent performance across a wide temperature range.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel, palladium, gold, and silver terminal finishes ensures excellent conductivity, corrosion resistance, and long-term reliability of electrical connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easy installation and connection, improving installation efficiency and reducing the likelihood of wiring errors.

Maximum Seated Height: 1.07 mm

The compact maximum seated height of 1.07mm contributes to a low-profile design, making it suitable for applications with space constraints or height limitations.

Width: 3 mm

The narrow width of 3mm helps in compact PCB layout designs and enables close placement of components, optimizing board space and improving overall system integration.

Output Polarity: INVERTED

With inverted output polarity, the device is compatible with various circuit configurations and can be easily integrated into existing systems without polarity conflicts.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes, preventing damage to the device during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables reliable soldering and reflow operations, ensuring strong and durable connections for the device on the PCB.

Length: 3 mm

The compact length of 3mm contributes to a small footprint and space-saving design, making it suitable for applications with size constraints or limited board space.

Temperature Grade: COMMERCIAL

Commercial-grade temperature specifications indicate that the device is suitable for standard operating conditions in commercial applications, offering performance and reliability for typical usage scenarios.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of bipolar and CMOS technologies, offering high-speed operation, low power consumption, and robustness in a single device.

Terminal Form: GULL WING

The gull-wing terminal form simplifies surface mount assembly and provides secure mechanical attachment to the PCB, ensuring reliable electrical connections and efficient manufacturing processes.

Maximum Supply Current: 0.45 mA

The low maximum supply current consumption of 0.45mA helps in reducing power consumption and heat dissipation, contributing to energy-efficient operation and extending battery life in portable applications.

Input Characteristics: STANDARD

The standard input characteristics ensure compatibility with a wide range of control signals and driving requirements, making the device versatile and easy to integrate into various applications.

Nominal Supply Voltage: 14 V

The nominal supply voltage of 14V provides a stable operating voltage for the device, ensuring consistent performance and reliable functionality within the specified voltage range.

Turn-on Time: 0.04 us

The fast turn-on time of 0.04 microseconds enables quick and efficient switching of the MOSFETs, reducing power losses and improving overall system response time.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for close spacing of terminals on the PCB, facilitating high-density mounting and compact circuit designs.

Nominal Output Peak Current Limit: 4 A

The nominal output peak current limit of 4A ensures reliable and safe operation of the connected MOSFETs, preventing overloading and protecting the device and the circuit from damage.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter-based interface IC type provides flexible driving options for various MOSFET configurations, allowing for optimized performance and compatibility with different load requirements.

Turn-off Time: 0.05 us

The fast turn-off time of 0.05 microseconds helps in reducing switching losses and improving efficiency by quickly turning off the MOSFETs, ensuring precise control and minimal power dissipation.

Technical Specifications

MOSFET Gate Drivers UCC37323DGNRG4 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

NO

Input Characteristics:

STANDARD

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Nominal Output Peak Current Limit:

4 A

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Current:

.45 mA

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.05 us

Turn-on Time:

.04 us

Width:

3 mm

Trade Compliance

UCC37323DGNRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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