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UCC27201ATDA3

Texas Instruments

UCC27201ATDA3 by Texas Instruments

UCC27201ATDA3 by Texas Instruments is a 2-channel half bridge peripheral driver with built-in under voltage protection. It has a max output current of 3A and comes in a rectangular surface mount package. Ideal for applications requiring standard input characteristics and driving loads with no lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,189 parts In-Stock

1+ parts

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5,189

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Digiode

USA . 323 parts In-Stock

1+ parts

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323

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 3,819 parts In-Stock

1+ parts

$9.632

100+ parts

$8.765

1k+ parts

$7.898

10k+ parts

-

3,819

$9.632

$8.765

$7.898

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Parana Technologies

USA . 2,143 parts In-Stock

1+ parts

$10.498

100+ parts

-

1k+ parts

$11.011

10k+ parts

-

2,143

$10.498

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$11.011

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DigiPath Technology Company

USA . 450 parts In-Stock

1+ parts

$11.560

100+ parts

-

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450

$11.560

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ChromeModa Solutions

Germany . 2,482 parts In-Stock

1+ parts

$11.796

100+ parts

$9.673

1k+ parts

-

10k+ parts

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2,482

$11.796

$9.673

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IDEA Electronic Components Group

UK . 1,120 parts In-Stock

1+ parts

$11.796

100+ parts

$11.206

1k+ parts

$10.616

10k+ parts

-

1,120

$11.796

$11.206

$10.616

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One Stop Electronics

USA . 1,079 parts In-Stock

1+ parts

$17.500

100+ parts

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1,079

$17.500

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AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$18.560

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845

$18.560

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Microchip USA

USA . 2,581 parts In-Stock

1+ parts

$31.000

100+ parts

$30.810

1k+ parts

$30.710

10k+ parts

$30.610

2,581

$31.000

$30.810

$30.710

$30.610

Corphita

USA . 4,708 parts In-Stock

1+ parts

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4,708

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Overview

Enhance your electronic designs with the UCC27201ATDA3 by Texas Instruments, a top-quality peripheral driver that offers unparalleled reliability and performance. Manufactured by industry leader Texas Instruments, this product is designed to exceed expectations in a variety of applications. With built-in protections against under-voltage and a maximum output current of 3A, this driver ensures optimal functionality and safety for your projects. Trust Texas Instruments to deliver cutting-edge technology that adds value and efficiency to your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and compact installation on PCBs, saving space and simplifying assembly processes.

Built-in Protections: UNDER VOLTAGE

Built-in under voltage protection ensures the stability and longevity of connected devices by preventing damage due to insufficient voltage.

Maximum Output Current: 3 A

High maximum output current of 3 A allows for driving higher power peripherals without the risk of overload or damage.

No. of Channels: 2

Having 2 channels enables simultaneous control of multiple peripherals, increasing the versatility and functionality of the driver.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half bridge based interface IC type offers efficient and precise control over connected peripherals, resulting in reliable performance.

Technical Specifications

Peripheral Drivers UCC27201ATDA3 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

UNDER VOLTAGE

Driver No. of Bits:

2

Input Characteristics:

STANDARD

JESD-30 Code:

R-XUUC-N10

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Output Current:

3 A

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

UCC27201ATDA3 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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