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UCC2626DWTR

Texas Instruments

UCC2626DWTR by Texas Instruments

UCC2626DWTR by Texas Instruments is a Motion Control IC with 12V nominal voltage and 28 terminals. It is a Brushless DC Motor Controller in a small outline package, suitable for industrial applications. Operating temperature ranges from -40 to 85°C, making it ideal for various motion control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,686 parts In-Stock

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6,686

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Digiode

USA . 3,836 parts In-Stock

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3,836

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Distributors (Availability)

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Semicontronic

India . 370 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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-

370

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 885 parts In-Stock

1+ parts

$4.500

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885

$4.500

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Ampacity Inc.

Singapore . 178 parts In-Stock

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$6.500

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178

$6.500

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AZTECH Wire

Italy . 325 parts In-Stock

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$14.605

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325

$14.605

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Parana Technologies

USA . 1,476 parts In-Stock

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$20.654

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$20.767

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1,476

$20.654

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$20.767

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DigiPath Technology Company

USA . 2,244 parts In-Stock

1+ parts

$22.743

100+ parts

$20.923

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2,244

$22.743

$20.923

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IDEA Electronic Components Group

UK . 1,118 parts In-Stock

1+ parts

$23.207

100+ parts

$22.047

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$20.886

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1,118

$23.207

$22.047

$20.886

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ChromeModa Solutions

Germany . 731 parts In-Stock

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$23.207

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$19.030

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731

$23.207

$19.030

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Corphita

USA . 4,991 parts In-Stock

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4,991

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Corohmni

South Africa . 56 parts In-Stock

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Overview

Enhance your motion control applications with the UCC2626DWTR by Texas Instruments, a top-tier manufacturer known for quality and reliability. This small outline IC offers seamless surface mount installation and a wide temperature range, making it ideal for industrial use. With a nominal supply voltage of 12V and maximum output current of 0.2A, this brushless DC motor controller provides precise control and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability for long-term use.

Surface Mount YES

Easy to install and suitable for automated assembly processes, saving time and labor costs.

Nominal Supply Voltage (Vsup) 12 V

Compatible with common power sources, making it versatile for various applications.

Maximum Operating Temperature 85 °C

Can withstand high temperatures, suitable for industrial environments and extended operation.

Maximum Output Current 0.2 A

Capable of driving higher current loads, providing more power for motion control applications.

Technical Specifications

Motion Control ICs UCC2626DWTR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

14.5 V

Minimum Supply Voltage (Vsup):

11 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.5 mm

Trade Compliance

UCC2626DWTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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