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UCC2626PWG4

Texas Instruments

UCC2626PWG4 by Texas Instruments

UCC2626PWG4 by Texas Instruments is a Motion Control IC with 12V supply voltage, 0.2A output current, and BICMOS technology. Ideal for Brushless DC Motor Controllers in industrial applications due to its small outline package, dual terminals, and wide operating temperature range from -40°C to 85°C.

Median Price

$13.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$13.490

100+ parts

-

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68

$13.490

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Vyrian

USA . 2,185 parts In-Stock

1+ parts

-

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2,185

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Digiode

USA . 1,564 parts In-Stock

1+ parts

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1,564

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 256 parts In-Stock

1+ parts

$1.500

100+ parts

-

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256

$1.500

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Ampacity Inc.

Singapore . 1,182 parts In-Stock

1+ parts

$3.500

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1,182

$3.500

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Parana Technologies

USA . 1,841 parts In-Stock

1+ parts

$5.928

100+ parts

-

1k+ parts

$6.713

10k+ parts

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1,841

$5.928

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$6.713

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DigiPath Technology Company

USA . 1,288 parts In-Stock

1+ parts

$6.528

100+ parts

$6.006

1k+ parts

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1,288

$6.528

$6.006

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ChromeModa Solutions

Germany . 5,881 parts In-Stock

1+ parts

$6.661

100+ parts

$5.462

1k+ parts

-

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5,881

$6.661

$5.462

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IDEA Electronic Components Group

UK . 1,810 parts In-Stock

1+ parts

$6.661

100+ parts

-

1k+ parts

$5.995

10k+ parts

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1,810

$6.661

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$5.995

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AZTECH Wire

Italy . 741 parts In-Stock

1+ parts

$10.765

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741

$10.765

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$13.490

100+ parts

$12.816

1k+ parts

-

10k+ parts

$12.006

300

$13.490

$12.816

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$12.006

Component Stockers USA

USA . 476 parts In-Stock

1+ parts

$183.050

100+ parts

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476

$183.050

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Corphita

USA . 1,764 parts In-Stock

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1,764

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Microchip USA

USA . 1,195 parts In-Stock

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1,195

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Overview

Discover the power of efficient motion control with the UCC2626PWG4 by Texas Instruments. Crafted with precision and expertise, this Brushless DC Motor Controller offers unparalleled performance and reliability. From industrial automation to robotics, this small outline, thin profile IC is a game-changer in the field of motion control. With a wide operating temperature range and advanced BICMOS technology, it ensures optimal functionality in any environment. Elevate your projects with the UCC2626PWG4 and experience seamless control like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and portability are important.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into electronic devices, saving space and reducing overall product size.

Nominal Supply Voltage (Vsup): 12 V

Operating at a stable 12V supply voltage ensures consistent performance and reliability in a variety of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environments and maintain performance in elevated temperatures.

Technology: BICMOS

Being based on BICMOS technology allows for high-speed operation, low power consumption, and integration of both bipolar and CMOS components, making it a versatile and efficient choice.

Technical Specifications

Motion Control ICs UCC2626PWG4 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

14.5 V

Minimum Supply Voltage (Vsup):

11 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

UCC2626PWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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