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UC2834QG3

Texas Instruments

UC2834QG3 by Texas Instruments

UC2834QG3 by Texas Instruments is a Power Management IC with 20 terminals, operating at -40 to 85°C. It supports supply voltages from 5V to 35V and has a package style of CHIP CARRIER. Ideal for industrial applications requiring power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,839 parts In-Stock

1+ parts

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6,839

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Digiode

USA . 2,090 parts In-Stock

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2,090

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,424 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,424

$0.500

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Ampacity Inc.

Singapore . 1,160 parts In-Stock

1+ parts

$6.500

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1,160

$6.500

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Semicontronic

India . 1,014 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

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1,014

$7.500

$7.312

$7.275

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Parana Technologies

USA . 2,153 parts In-Stock

1+ parts

$8.336

100+ parts

-

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$8.962

10k+ parts

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2,153

$8.336

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$8.962

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DigiPath Technology Company

USA . 1,436 parts In-Stock

1+ parts

$9.179

100+ parts

$8.444

1k+ parts

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1,436

$9.179

$8.444

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ChromeModa Solutions

Germany . 6,614 parts In-Stock

1+ parts

$9.366

100+ parts

$7.680

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6,614

$9.366

$7.680

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IDEA Electronic Components Group

UK . 355 parts In-Stock

1+ parts

$9.366

100+ parts

$8.898

1k+ parts

$8.429

10k+ parts

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355

$9.366

$8.898

$8.429

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AZTECH Wire

Italy . 795 parts In-Stock

1+ parts

$18.768

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795

$18.768

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Component Stockers USA

USA . 539 parts In-Stock

1+ parts

$99.990

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539

$99.990

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Microchip USA

USA . 4,579 parts In-Stock

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4,579

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Corphita

USA . 2,137 parts In-Stock

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Corohmni

South Africa . 202 parts In-Stock

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Overview

Upgrade your power management solutions with the UC2834QG3 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable and efficient Power Management ICs that are essential for a wide range of applications. This chip carrier package provides customers with a durable and versatile solution for their power supply support circuit needs. With a wide operating temperature range and high supply voltage capabilities, this IC offers unmatched value and performance. Trust Texas Instruments to deliver cutting-edge technology that meets your power management requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the Power Management IC.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation of the Power Management IC on a PCB.

Nominal Supply Voltage (Vsup): 15 V

With a nominal supply voltage of 15V, this Power Management IC is suitable for a variety of applications requiring this voltage level.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability of the Power Management IC even in harsh environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability, enhancing the overall performance of the Power Management IC.

Moisture Sensitivity Level (MSL): 2

With a low MSL of 2, this Power Management IC is less prone to moisture damage during storage or assembly, ensuring its longevity.

Technical Specifications

Power Management ICs UC2834QG3 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDER AND OVER-VOLTAGE FAULT ALERT WITH PROGRAMMABLE DELAY

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8.965 mm

Trade Compliance

UC2834QG3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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