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UC2834NG4

Texas Instruments

UC2834NG4 by Texas Instruments

The Texas Instruments UC2834NG4 is a Power Management IC with 16 terminals, operating b/w -40 to 85°C. It supports supply voltages from 5V to 35V and features a rectangular package style. Ideal for industrial applications requiring power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,830 parts In-Stock

1+ parts

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5,830

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Digiode

USA . 1,343 parts In-Stock

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1,343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,283 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,283

$1.500

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Ampacity Inc.

Singapore . 701 parts In-Stock

1+ parts

$3.500

100+ parts

-

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701

$3.500

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AZTECH Wire

Italy . 826 parts In-Stock

1+ parts

$7.021

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826

$7.021

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Semicontronic

India . 1,150 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

-

1,150

$7.500

$7.312

$7.275

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Parana Technologies

USA . 719 parts In-Stock

1+ parts

$16.503

100+ parts

-

1k+ parts

$16.789

10k+ parts

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719

$16.503

-

$16.789

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DigiPath Technology Company

USA . 2,145 parts In-Stock

1+ parts

$18.172

100+ parts

$16.718

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2,145

$18.172

$16.718

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

1+ parts

$18.543

100+ parts

$17.616

1k+ parts

$16.689

10k+ parts

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2,015

$18.543

$17.616

$16.689

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ChromeModa Solutions

Germany . 628 parts In-Stock

1+ parts

$18.543

100+ parts

$15.205

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628

$18.543

$15.205

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Corphita

USA . 4,001 parts In-Stock

1+ parts

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4,001

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Corohmni

South Africa . 359 parts In-Stock

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359

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Overview

Power up your projects with the UC2834NG4 by Texas Instruments, a top-tier manufacturer known for its high-quality Power Management ICs. This versatile device offers unparalleled value and benefits, providing reliable and efficient power supply support for a wide range of industrial applications. With a wide operating temperature range and durable package body material, this IC ensures optimal performance under any conditions. Trust in Texas Instruments to deliver cutting-edge technology that meets your power management needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the components inside the package.

Nominal Supply Voltage (Vsup): 15 V

Suitable for applications requiring a stable 15V supply voltage.

No. of Terminals: 16

Sufficient number of terminals for connecting various components in the circuit.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in very low temperatures, providing versatility in application environments.

Technology: BIPOLAR

Bipolar technology offers high efficiency and reliability in power management circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy for manual or automated assembly on a PCB.

Technical Specifications

Power Management ICs UC2834NG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDER AND OVER-VOLTAGE FAULT ALERT WITH PROGRAMMABLE DELAY

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC2834NG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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