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UC1543N

Texas Instruments

UC1543N by Texas Instruments

UC1543N by Texas Instruments is a Power Management IC with 16 terminals, operating b/w -55 to 125 °C. It supports supply voltages from 4.5V to 40V and comes in a rectangular package style. Ideal for military-grade applications requiring power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,493 parts In-Stock

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Digiode

USA . 1,979 parts In-Stock

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1,979

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One Stop Electronics

USA . 1,056 parts In-Stock

1+ parts

$0.500

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1,056

$0.500

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Ampacity Inc.

Singapore . 438 parts In-Stock

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$3.500

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438

$3.500

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Semicontronic

India . 1,190 parts In-Stock

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$4.500

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$4.388

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$4.365

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1,190

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 661 parts In-Stock

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$17.435

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661

$17.435

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Parana Technologies

USA . 1,554 parts In-Stock

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$20.024

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$19.958

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1,554

$20.024

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$19.958

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ChromeModa Solutions

Germany . 5,757 parts In-Stock

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$22.499

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$18.449

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5,757

$22.499

$18.449

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IDEA Electronic Components Group

UK . 357 parts In-Stock

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$22.499

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$21.374

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$20.249

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357

$22.499

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$20.249

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Corphita

USA . 2,737 parts In-Stock

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DigiPath Technology Company

USA . 1,172 parts In-Stock

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$20.285

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Corohmni

South Africa . 475 parts In-Stock

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Overview

Elevate your power management game with the UC1543N by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments has once again delivered a game-changing product. This power management IC is versatile and can be used in a variety of applications, offering customers unmatched value and benefits. Say goodbye to power supply issues and hello to seamless operations with the UC1543N. Experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures a lightweight and durable construction, making the product suitable for a variety of applications.

Nominal Supply Voltage (Vsup): 10 V

The nominal supply voltage of 10V provides a stable power input for the device, ensuring consistent performance under various operating conditions.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures without compromising functionality, ideal for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

The product's ability to operate in temperatures as low as -55°C ensures reliable performance in cold environments, making it suitable for outdoor and harsh conditions.

Width (mm): 7.62 mm

The compact width of 7.62mm allows for easy integration into space-constrained applications, enabling versatile installation options.

Technical Specifications

Power Management ICs UC1543N attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T16

Length:

19.3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC1543N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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