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UC1544J883B

Texas Instruments

UC1544J883B by Texas Instruments

UC1544J883B by Texas Instruments is a MIL-STD-883 Class B power management IC with 18 terminals. It operates b/w -55 to 125 °C, supporting supply voltages from 4.7V to 40V. Ideal for military applications due to its CMOS technology and glass-sealed ceramic package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,581 parts In-Stock

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Digiode

USA . 842 parts In-Stock

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Bristol Electronics

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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One Stop Electronics

USA . 1,284 parts In-Stock

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$4.500

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Parana Technologies

USA . 2,250 parts In-Stock

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$10.974

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DigiPath Technology Company

USA . 2,089 parts In-Stock

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$11.519

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$10.597

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ChromeModa Solutions

Germany . 4,739 parts In-Stock

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$11.754

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$9.638

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IDEA Electronic Components Group

UK . 1,938 parts In-Stock

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$11.754

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$11.166

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$10.579

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AZTECH Wire

Italy . 842 parts In-Stock

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$18.623

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Corphita

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Overview

Enhance your power management solutions with the UC1544J883B by Texas Instruments, a top-quality Power Management IC designed to meet MIL-STD-883 Class B standards. With a wide supply voltage range of 4.5V to 40V and military-grade temperature tolerance, this IC offers unparalleled reliability and performance. Perfect for various applications in the aerospace, defense, and industrial sectors, the UC1544J883B ensures optimal power distribution and efficiency. Trust in Texas Instruments' expertise and invest in this innovative product to elevate your electronic systems to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material ensures durability and reliability, making this Power Management IC suitable for rugged environments.

Screening Level: MIL-STD-883 Class B

Compliance with MIL-STD-883 Class B screening level standards indicates high quality and reliability, meeting stringent military standards.

Nominal Supply Voltage (Vsup): 10 V

The 10V supply voltage allows for compatibility with a wide range of applications, providing flexibility in power management.

Power Supplies (V): 4.5/40

Support for power supplies ranging from 4.5V to 40V offers versatility in powering various electronic devices and systems.

No. of Terminals: 18

The 18 terminals provide ample connection points for interfacing with other components, facilitating efficient power distribution.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this Power Management IC can withstand elevated temperatures without performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C enables reliable operation in cold environments, enhancing the product's versatility.

Technology: CMOS

Utilizing CMOS technology offers power efficiency and high noise immunity, contributing to improved overall performance.

Technical Specifications

Power Management ICs UC1544J883B attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-GDIP-T18

Length:

22.606 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.5/40

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4.7 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

UC1544J883B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-304-5249, 5962013045249, 5962-01-322-3210, 5962013223210, 5962-01-435-2338, 5962014352338

NIIN

013045249, 013223210, 014352338

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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