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TWL6032A2BEYFFT

Texas Instruments

TWL6032A2BEYFFT by Texas Instruments

TWL6032A2BEYFFT by Texas Instruments is a Power Management IC with 155 terminals, supporting 17 channels and 14 outputs. It operates in industrial temperature range (-40 to 85°C) with output voltage ranging from 0.6V to 3.3V, making it ideal for power supply support circuits.

Median Price

$7.418

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

$6.030

100+ parts

$5.910

1k+ parts

$5.790

10k+ parts

-

1,000

$6.030

$5.910

$5.790

-

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$8.806

100+ parts

$7.179

1k+ parts

$4.786

10k+ parts

-

1,500

$8.806

$7.179

$4.786

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,740 parts In-Stock

1+ parts

$8.366

100+ parts

-

1k+ parts

-

10k+ parts

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4,740

$8.366

-

-

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Vyrian

USA . 6,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,582

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,482 parts In-Stock

1+ parts

$7.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,482

$7.490

-

-

-

Semicontronic

India . 1,189 parts In-Stock

1+ parts

$7.490

100+ parts

$7.303

1k+ parts

$7.265

10k+ parts

-

1,189

$7.490

$7.303

$7.265

-

Corphita

USA . 3,452 parts In-Stock

1+ parts

$7.925

100+ parts

-

1k+ parts

-

10k+ parts

-

3,452

$7.925

-

-

-

Corohmni

South Africa . 274 parts In-Stock

1+ parts

$8.806

100+ parts

-

1k+ parts

-

10k+ parts

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274

$8.806

-

-

-

Parana Technologies

USA . 2,360 parts In-Stock

1+ parts

$10.061

100+ parts

-

1k+ parts

$10.616

10k+ parts

-

2,360

$10.061

-

$10.616

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AZTECH Wire

Italy . 56 parts In-Stock

1+ parts

$10.120

100+ parts

-

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-

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56

$10.120

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-

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IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$11.305

100+ parts

$10.740

1k+ parts

$10.174

10k+ parts

-

1,720

$11.305

$10.740

$10.174

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ChromeModa Solutions

Germany . 840 parts In-Stock

1+ parts

$11.305

100+ parts

$9.270

1k+ parts

-

10k+ parts

-

840

$11.305

$9.270

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-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,000

-

-

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DigiPath Technology Company

USA . 114 parts In-Stock

1+ parts

-

100+ parts

$10.193

1k+ parts

-

10k+ parts

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114

-

$10.193

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-

Overview

Unlock the power of efficient energy management with the TWL6032A2BEYFFT by Texas Instruments. This high-quality Power Management IC offers unparalleled performance and reliability, setting it apart from the competition. Ideal for a wide range of applications, this product boasts a sleek rectangular design with 155 terminals, making it perfect for various surface mount scenarios. Say goodbye to energy waste and hello to optimized power distribution with this innovative solution. Experience the value, benefits, and advantages that Texas Instruments brings to your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting onto a PCB, saving space and simplifying assembly process.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, ensuring optimal layout and design.

No. of Terminals: 155

High number of terminals provide multiple connection options, allowing for versatile power management configurations.

Maximum Operating Temperature: 85 °C

Can operate reliably in high temperature environments, making it suitable for industrial applications.

Minimum Output Voltage: 0.6 V

Ability to output low voltage levels enables powering of various sensitive components within a system.

Minimum Operating Temperature: -40 °C

Operates effectively in low temperature conditions, ensuring consistent performance in diverse environments.

Maximum Output Voltage: 3.3 V

Provides a stable output voltage of up to 3.3 V, suitable for a wide range of electronic devices and components.

Maximum Output Current: 5 A

Capable of delivering high current output, making it suitable for power-hungry applications.

No. of Channels: 17

Multiple channels allow for simultaneous monitoring and control of various power outputs, enhancing system flexibility.

Technical Specifications

Power Management ICs TWL6032A2BEYFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

17

No. of Functions:

1

No. of Outputs:

14

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TWL6032A2BEYFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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