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TWL6032A2B8YFFT

Texas Instruments

TWL6032A2B8YFFT by Texas Instruments

TWL6032A2B8YFFT by Texas Instruments is a Power Management IC with 155 terminals in a grid array package. It operates b/w -40 to 85°C, providing output voltage from 0.6V to 3.3V at max current of 5A. Ideal for industrial power supply support circuits with 17 channels and very thin profile design.

Median Price

$10.340

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$10.340

100+ parts

-

1k+ parts

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10k+ parts

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950

$10.340

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,774 parts In-Stock

1+ parts

$9.823

100+ parts

-

1k+ parts

-

10k+ parts

-

2,774

$9.823

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Vyrian

USA . 2,545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,545

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 537 parts In-Stock

1+ parts

$1.291

100+ parts

-

1k+ parts

$2.046

10k+ parts

-

537

$1.291

-

$2.046

-

DigiPath Technology Company

USA . 803 parts In-Stock

1+ parts

$1.422

100+ parts

$1.308

1k+ parts

-

10k+ parts

-

803

$1.422

$1.308

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-

ChromeModa Solutions

Germany . 6,781 parts In-Stock

1+ parts

$1.451

100+ parts

$1.190

1k+ parts

-

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6,781

$1.451

$1.190

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IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$1.451

100+ parts

-

1k+ parts

$1.306

10k+ parts

-

1,092

$1.451

-

$1.306

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Ampacity Inc.

Singapore . 822 parts In-Stock

1+ parts

$8.790

100+ parts

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822

$8.790

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Semicontronic

India . 581 parts In-Stock

1+ parts

$8.790

100+ parts

$8.570

1k+ parts

$8.526

10k+ parts

-

581

$8.790

$8.570

$8.526

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Corphita

USA . 1,396 parts In-Stock

1+ parts

$9.306

100+ parts

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10k+ parts

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1,396

$9.306

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Corohmni

South Africa . 188 parts In-Stock

1+ parts

$10.340

100+ parts

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188

$10.340

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AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$19.420

100+ parts

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10k+ parts

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244

$19.420

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Microchip USA

USA . 1,588 parts In-Stock

1+ parts

$24.630

100+ parts

$24.280

1k+ parts

$24.100

10k+ parts

$23.930

1,588

$24.630

$24.280

$24.100

$23.930

A-Z Elektronik GmbH

Germany . 6,807 parts In-Stock

1+ parts

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100+ parts

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6,807

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Elevate your power management game with the TWL6032A2B8YFFT by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers top-notch Power Management ICs that are designed to enhance performance and efficiency. This cutting-edge product is perfect for a wide range of applications, providing customers with reliable and precise power supply support. With 17 channels, 14 outputs, and a maximum output current of 5A, this IC offers unparalleled value and benefits. Say goodbye to power issues and hello to seamless operation with the TWL6032A2B8YFFT.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable mounting of the IC onto a PCB, saving space and facilitating automated assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor that is easy to handle and integrate into various electronic devices.

No. of Terminals: 155

High number of terminals enables complex functionality and connectivity options, making the IC versatile for different power management applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Output Voltage: 0.6 V

Low minimum output voltage allows for precise control and regulation of power supply voltages, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the IC can function effectively even in extreme cold conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

High-quality terminal finish ensures strong connections and prevents corrosion, leading to long-term reliability.

Maximum Output Voltage: 3.3 V

Suitable maximum output voltage for powering various electronic components and systems within safe operating limits.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, improving design flexibility and efficiency.

Maximum Seated Height: 0.625 mm

Low-profile package design with maximum seated height allows for compact and slim electronic device designs.

Width (mm): 5.214 mm

Narrow width facilitates space-saving integration of the IC into tight PCB layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specialized IC type designed specifically for power management applications, providing efficient and reliable voltage regulation.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement allows for operation in battery-powered devices and low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper solder reflow and reliable PCB assembly during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures compatibility with lead-free soldering processes and industry standards.

Length: 5.364 mm

Compact length enables space-efficient placement of the IC on the PCB board, optimizing overall system layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating environments with varying temperature conditions.

Maximum Output Current: 5 A

High maximum output current rating allows the IC to supply sufficient power to multiple components or circuits simultaneously.

No. of Channels: 17

Multiple channels provide independent power control and monitoring options, making the IC suitable for complex power distribution systems.

Terminal Form: BALL

Ball terminal form simplifies the soldering process and ensures secure electrical connections on the PCB board.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting on the PCB, saving board space and accommodating more functionalities in a limited area.

Maximum Supply Voltage (Vsup): 4.8 V

Safe maximum supply voltage rating ensures protection against overvoltage conditions and reliable operation within specified limits.

No. of Outputs: 14

Multiple outputs provide versatility in power supply options, allowing for flexible configurations and distribution of power to various components.

Technical Specifications

Power Management ICs TWL6032A2B8YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

17

No. of Functions:

1

No. of Outputs:

14

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TWL6032A2B8YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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