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TWL6032A2B6YFFR

Texas Instruments

TWL6032A2B6YFFR by Texas Instruments

TWL6032A2B6YFFR by Texas Instruments is a Power Management IC with 155 terminals in a rectangular package. It operates b/w -40 to 85°C, providing output voltage range of 0.6V to 3.3V for industrial applications requiring up to 5A current across its 17 channels.

Median Price

$8.806

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,100 parts In-Stock

1+ parts

$8.806

100+ parts

$7.179

1k+ parts

$4.786

10k+ parts

-

13,100

$8.806

$7.179

$4.786

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 147 parts In-Stock

1+ parts

$8.366

100+ parts

-

1k+ parts

-

10k+ parts

-

147

$8.366

-

-

-

Vyrian

USA . 4,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,709

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 560 parts In-Stock

1+ parts

$3.214

100+ parts

-

1k+ parts

$3.736

10k+ parts

-

560

$3.214

-

$3.736

-

ChromeModa Solutions

Germany . 6,907 parts In-Stock

1+ parts

$3.611

100+ parts

$2.961

1k+ parts

-

10k+ parts

-

6,907

$3.611

$2.961

-

-

IDEA Electronic Components Group

UK . 777 parts In-Stock

1+ parts

$3.611

100+ parts

-

1k+ parts

$3.250

10k+ parts

-

777

$3.611

-

$3.250

-

Semicontronic

India . 13,073 parts In-Stock

1+ parts

$7.490

100+ parts

$7.303

1k+ parts

$7.265

10k+ parts

-

13,073

$7.490

$7.303

$7.265

-

Ampacity Inc.

Singapore . 12,768 parts In-Stock

1+ parts

$7.490

100+ parts

-

1k+ parts

-

10k+ parts

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12,768

$7.490

-

-

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Corphita

USA . 4,029 parts In-Stock

1+ parts

$7.925

100+ parts

-

1k+ parts

-

10k+ parts

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4,029

$7.925

-

-

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Corohmni

South Africa . 473 parts In-Stock

1+ parts

$8.806

100+ parts

-

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-

10k+ parts

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473

$8.806

-

-

-

AZTECH Wire

Italy . 449 parts In-Stock

1+ parts

$9.510

100+ parts

-

1k+ parts

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449

$9.510

-

-

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Lixinc

USA . 18,484 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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18,484

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,000

-

-

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DigiPath Technology Company

USA . 696 parts In-Stock

1+ parts

-

100+ parts

$3.256

1k+ parts

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10k+ parts

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696

-

$3.256

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A-Z Elektronik GmbH

Germany . 525 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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525

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Overview

Enhance your power management solutions with the TWL6032A2B6YFFR by Texas Instruments. Designed with precision and reliability in mind, this Power Management IC offers top-notch performance for a wide range of applications. With its surface mount capabilities and 155 terminals, this product provides efficient power supply support circuitry that is essential in today's industrial settings. Trust in Texas Instruments to deliver high-quality products that meet all your power management needs. Elevate your projects with the TWL6032A2B6YFFR and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting of the IC onto a PCB, saving space and making the overall design more compact.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easier to align and mount onto a PCB, improving the overall ease of assembly.

No. of Terminals: 155

With a high number of terminals, this IC can support a wide range of connections and functionalities, increasing its versatility in power management applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Output Voltage: 0.6 V

The low minimum output voltage allows for precise power control and regulation, making it suitable for a variety of power management tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can still function properly even in extremely cold environments, increasing its reliability and durability.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of these materials for terminal finish enhances solderability and ensures good electrical conductivity, improving the overall performance of the IC.

Maximum Output Voltage: 3.3 V

The high maximum output voltage allows for handling a wide range of power requirements, making this IC suitable for various applications.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier soldering and connections, making the assembly process more efficient.

Maximum Seated Height: 0.625 mm

The low maximum seated height ensures that the IC can be mounted in compact spaces without compromising on performance or reliability.

Width (mm): 5.214 mm

The slim width of the IC allows for space-saving design and integration into tight spaces, making it ideal for compact electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC can efficiently regulate and manage power distribution, ensuring stable and reliable operation of electronic devices.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement makes this IC compatible with a wide range of power sources, enhancing its versatility in different applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures that the IC can withstand reflow soldering processes without compromising its performance or reliability.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this IC can withstand soldering processes at elevated temperatures, ensuring secure and reliable connections.

Length: 5.364 mm

The compact length of the IC allows for easy integration into small electronic devices, making it a suitable choice for miniaturized applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this IC is built to withstand harsh environmental conditions and operate reliably in demanding applications.

Maximum Output Current: 5 A

With a high maximum output current, this IC can handle power requirements of up to 5A, making it suitable for demanding power management tasks.

No. of Channels: 17

The high number of channels allows for multiple inputs and outputs to be processed simultaneously, making this IC suitable for complex power management applications.

Terminal Form: BALL

The ball terminal form provides secure connections and enhances the reliability of the IC, ensuring stable performance in various operating conditions.

Terminal Pitch: 0.4 mm

The tight terminal pitch allows for high-density mounting of the IC on a PCB, saving space and enabling efficient design of compact electronic devices.

Maximum Supply Voltage (Vsup): 4.8 V

The high maximum supply voltage capability enables the IC to support a wide range of power sources, making it versatile for different applications.

No. of Outputs: 14

With 14 outputs, this IC can provide power management for multiple circuits simultaneously, making it suitable for applications requiring multiple voltage outputs.

Technical Specifications

Power Management ICs TWL6032A2B6YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

17

No. of Functions:

1

No. of Outputs:

14

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TWL6032A2B6YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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