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TVP5041PFP

Texas Instruments

TVP5041PFP by Texas Instruments

TVP5041PFP by Texas Instruments is a color signal decoder with 80 terminals in a square flatpack package. Operating temperature range from 0 to 70°C, voltage supply of 3.1-3.5V, and max current of 490mA make it ideal for commercial applications requiring precise color signal conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,210 parts In-Stock

1+ parts

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8,210

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Digiode

USA . 2,344 parts In-Stock

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2,344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,808 parts In-Stock

1+ parts

$1.268

100+ parts

-

1k+ parts

$2.033

10k+ parts

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1,808

$1.268

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$2.033

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DigiPath Technology Company

USA . 364 parts In-Stock

1+ parts

$1.396

100+ parts

-

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364

$1.396

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ChromeModa Solutions

Germany . 5,098 parts In-Stock

1+ parts

$1.425

100+ parts

$1.168

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5,098

$1.425

$1.168

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IDEA Electronic Components Group

UK . 1,261 parts In-Stock

1+ parts

$1.425

100+ parts

-

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$1.282

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1,261

$1.425

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$1.282

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AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$8.549

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638

$8.549

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One Stop Electronics

USA . 509 parts In-Stock

1+ parts

$14.800

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509

$14.800

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Corphita

USA . 131 parts In-Stock

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131

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Overview

Elevate your viewing experience with the Texas Instruments TVP5041PFP Color Signal Converter. Crafted with precision and expertise, this decoder from a renowned manufacturer offers unparalleled quality and reliability. Ideal for a wide range of applications, this product seamlessly converts signals to deliver vibrant and crisp colors. Enhance your entertainment setup with the value and benefits this innovative converter brings, setting a new standard for visual excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Package Shape: SQUARE

The square shape of the package provides a compact and space-saving design.

General IC Type: COLOR SIGNAL DECODER

The specific IC type ensures accurate decoding of color signals for optimal performance.

No. of Terminals: 80

Having a high number of terminals allows for connectivity with multiple components, enhancing versatility.

Package Style: FLATPACK, THIN PROFILE, FINE PITCH

This package style offers a slim profile and fine pitch for precise and efficient integration into electronic devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in a wide range of environments.

Terminal Position: QUAD

The quad terminal position provides stable connections for reliable signal transmission.

Maximum Seated Height: 1.2 mm

The low seated height contributes to a compact overall design.

Width: 12 mm

The moderate width offers a balance between space efficiency and connectivity.

Minimum Supply Voltage (Vsup): 3.1 V

The low minimum supply voltage ensures efficient power consumption.

Length: 12 mm

The compact length contributes to a space-saving design.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where reliability and performance are crucial.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections for stable operation.

Maximum Supply Current: 490 mA

The high maximum supply current allows for robust performance under demanding conditions.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables precise assembly and electrical connections.

Maximum Supply Voltage (Vsup): 3.5 V

The moderate maximum supply voltage ensures compatibility with a variety of power sources.

Technical Specifications

Color Signal Converters TVP5041PFP attributes and parameters. Explore more Color Signal Converters devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V DIGITAL SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

490 mA

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

3.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

TVP5041PFP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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