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TUSB3200CPAHG4

Texas Instruments

TUSB3200CPAHG4 by Texas Instruments

TUSB3200CPAHG4 by Texas Instruments is a BUS CONTROLLER IC with 52 terminals, operating at 3.3V. It has a temperature range of 0-70°C and supports USB technology. The package style is FLATPACK, THIN PROFILE making it suitable for various applications requiring USB bus control.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,618 parts In-Stock

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Chip Stock

USA . 1,086 parts In-Stock

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Digiode

USA . 364 parts In-Stock

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364

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Distributors (Availability)

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AZTECH Wire

Italy . 811 parts In-Stock

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$16.416

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811

$16.416

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Parana Technologies

USA . 1,828 parts In-Stock

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$27.467

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$36.234

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1,828

$27.467

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$36.234

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One Stop Electronics

USA . 1,515 parts In-Stock

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$29.000

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$29.000

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DigiPath Technology Company

USA . 742 parts In-Stock

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$30.245

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742

$30.245

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ChromeModa Solutions

Germany . 3,271 parts In-Stock

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$30.862

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$25.307

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$30.862

$25.307

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IDEA Electronic Components Group

UK . 1,527 parts In-Stock

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$30.862

100+ parts

$29.319

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$27.776

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1,527

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$27.776

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Corohmni

South Africa . 1,130 parts In-Stock

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$47.493

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Kepictronics

USA . 12,834 parts In-Stock

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Corphita

USA . 3,374 parts In-Stock

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Microchip USA

USA . 310 parts In-Stock

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Perfect Parts

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Overview

Experience seamless data transfer and connectivity with the TUSB3200CPAHG4 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable bus controllers that are perfect for a wide range of applications. This versatile device offers customers unparalleled value, providing fast and efficient communication between devices. Upgrade your systems today with the TUSB3200CPAHG4 and enjoy the benefits of superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the bus controller, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this bus controller can handle fluctuations in power input without risk of damage, ensuring stable performance.

Package Shape: SQUARE

The square package shape is often preferred for compact designs and efficient use of space on the circuit board.

No. of Terminals: 52

Having a high number of terminals allows for versatile connectivity options and interfaces with other components in the system.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style is suitable for applications where space is limited, providing a low profile design for compact electronic devices.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making this bus controller versatile and adaptable to different systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this bus controller can withstand elevated temperatures without performance degradation, ensuring reliable operation in various environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this bus controller suitable for use in diverse environments, from extreme cold to standard room temperature settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold for terminal finish enhances conductivity and reliability of connections, reducing the risk of signal interference or loss during operation.

Terminal Position: QUAD

The quad terminal position provides stable and secure connectivity, ensuring consistent performance and communication between the bus controller and other components.

Maximum Seated Height: 1.2 mm

Having a low maximum seated height enables a compact and slim design for the overall electronic system, ideal for space-constrained applications.

Width: 10 mm

The 10mm width offers a balance between compactness and ease of integration, making this bus controller suitable for various electronic devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient soldering processes during assembly, reducing the risk of thermal damage to the bus controller.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable and robust soldering of the bus controller onto the circuit board, ensuring secure connections and long-term performance.

Length: 10 mm

The 10mm length contributes to the overall compactness and space-saving design of the bus controller, making it suitable for applications where size constraints are a concern.

Temperature Grade: COMMERCIAL

Designed for commercial use, this bus controller meets industry standards for reliability and performance in typical operating environments, making it a reliable choice for various applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

As a universal serial bus controller, this product offers versatile connectivity options and compatibility with a wide range of devices and systems, making it a versatile and valuable component for different applications.

Technology: CMOS

The CMOS technology used in this bus controller provides efficient power consumption and fast processing speeds, contributing to energy efficiency and optimal performance in electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connections during assembly, ensuring reliable performance of the bus controller in the overall electronic system.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this bus controller aligns with standard power requirements, offering compatibility with common power sources and components in electronic systems.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch provides precise and reliable connections, contributing to signal integrity and stable communication between the bus controller and other components in the system.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates the level of protection against moisture exposure, ensuring the longevity and reliability of the bus controller in various environmental conditions with moderate moisture presence.

Technical Specifications

Bus Controllers TUSB3200CPAHG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO HAVING SECONDARY DIGITAL SUPPLY 5V(TYP), 6 MHZ CRYSTAL INPUT.

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TUSB3200CPAHG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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