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TUSB215QRGYTQ1

Texas Instruments

TUSB215QRGYTQ1 by Texas Instruments

TUSB215QRGYTQ1 by Texas Instruments is a BUS CONTROLLER IC with 14 terminals, operating voltage range of 4.4-5.5 V, and data transfer rate of 60.03 MBps. It is designed for industrial applications requiring USB bus compatibility and operates in temperatures ranging from -40 to 105°C.

Median Price

$4.370

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 61,590 parts In-Stock

1+ parts

$4.959

100+ parts

$4.345

1k+ parts

$2.455

10k+ parts

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61,590

$4.959

$4.345

$2.455

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DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.782

10k+ parts

$3.642

250

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-

$3.782

$3.642

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,263 parts In-Stock

1+ parts

$4.711

100+ parts

-

1k+ parts

-

10k+ parts

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1,263

$4.711

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Vyrian

USA . 9,058 parts In-Stock

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9,058

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 64 parts In-Stock

1+ parts

$3.770

100+ parts

-

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-

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64

$3.770

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Corphita

USA . 993 parts In-Stock

1+ parts

$4.463

100+ parts

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993

$4.463

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Parana Technologies

USA . 1,558 parts In-Stock

1+ parts

$62.094

100+ parts

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10k+ parts

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1,558

$62.094

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-

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ChromeModa Solutions

Germany . 4,578 parts In-Stock

1+ parts

$69.768

100+ parts

$57.210

1k+ parts

-

10k+ parts

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4,578

$69.768

$57.210

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IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$69.768

100+ parts

$66.280

1k+ parts

$62.791

10k+ parts

-

883

$69.768

$66.280

$62.791

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Lixinc

USA . 13,660 parts In-Stock

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13,660

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DigiPath Technology Company

USA . 307 parts In-Stock

1+ parts

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100+ parts

$62.903

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307

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$62.903

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Overview

Unlock the power of seamless data transfer with the TUSB215QRGYTQ1 by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. As a leading bus controller in the industry, this versatile chip carrier offers reliability and efficiency for your industrial applications. With a maximum data transfer rate of 60.03 MBps and a wide temperature range from -40 to 105°C, this device ensures optimal performance in any environment. Trust Texas Instruments to deliver quality and innovation, making your connectivity solutions faster and more reliable than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus controller.

Surface Mount: YES

Allows for easy and secure mounting onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, ensuring compatibility with a wide range of systems.

Screening Level: AEC-Q100

Adheres to automotive industry standards for reliability and performance.

Package Shape: SQUARE

Facilitates easy integration into existing circuit layouts.

No. of Terminals: 14

Provides ample connection points for interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal management and space efficiency in the overall design.

Minimum Supply Voltage: 4.4 V

Can operate effectively even with lower voltage inputs.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, suitable for industrial environments.

Maximum Data Transfer Rate: 60.03 MBps

Efficiently handles high-speed data transfers, ensuring smooth operation.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant connection interface.

Terminal Position: QUAD

Enables easy integration with other components on the circuit board.

Maximum Seated Height: 1 mm

Contributes to a slim and compact form factor.

Width: 3.5 mm

Compact size enables flexibility in placement within the system.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly within a specific time frame.

Peak Reflow Temperature °C: 260

Meets industrial standards for reflow soldering processes.

Length: 3.5 mm

Compact size allows for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial operating conditions.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports universal serial bus communication protocol, enabling versatile connectivity options.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Terminal Form: NO LEAD

Facilitates lead-free soldering processes, meeting environmental regulations.

Maximum Supply Current: 0.03 mA

Operates with low power consumption, reducing energy consumption.

Nominal Supply Voltage: 5 V

Standard voltage requirement compatible with most systems.

Bus Compatibility: I2C

Supports I2C bus communication, widely used in various applications.

Terminal Pitch: 0.5 mm

Fine pitch allows for compact and efficient layout on the circuit board.

Moisture Sensitivity Level (MSL): 2

Designed to withstand moderate moisture exposure during storage and handling.

Technical Specifications

Bus Controllers TUSB215QRGYTQ1 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

0

Bus Compatibility:

I2C

Maximum Data Transfer Rate:

60.03 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e3

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

.03 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

TUSB215QRGYTQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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