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TUSB1210BRHBTQ1

Texas Instruments

TUSB1210BRHBTQ1 by Texas Instruments

TUSB1210BRHBTQ1 by Texas Instruments is an Ethernet transceiver with 32 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. The terminal finish includes Ni/Pd/Au/Ag, making it ideal for network interfaces in automotive applications.

Median Price

$3.513

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,426 parts In-Stock

1+ parts

$3.513

100+ parts

$3.078

1k+ parts

$1.739

10k+ parts

-

13,426

$3.513

$3.078

$1.739

-

Mouser Electronics

USA . 10,295 parts In-Stock

1+ parts

$4.900

100+ parts

$3.120

1k+ parts

$2.590

10k+ parts

$2.500

10,295

$4.900

$3.120

$2.590

$2.500

DigiKey

USA . 183 parts In-Stock

1+ parts

$4.900

100+ parts

$3.114

1k+ parts

$2.823

10k+ parts

$2.713

183

$4.900

$3.114

$2.823

$2.713

Chip1Stop

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.127

10k+ parts

-

500

-

-

$2.127

-

Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$2.510

1k+ parts

$2.240

10k+ parts

$2.110

50

-

$2.510

$2.240

$2.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,898 parts In-Stock

1+ parts

$2.299

100+ parts

-

1k+ parts

-

10k+ parts

-

2,898

$2.299

-

-

-

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$2.340

-

-

-

Vyrian

USA . 5,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,344

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,817 parts In-Stock

1+ parts

$1.810

100+ parts

-

1k+ parts

-

10k+ parts

-

4,817

$1.810

-

-

-

Corphita

USA . 775 parts In-Stock

1+ parts

$2.178

100+ parts

-

1k+ parts

-

10k+ parts

-

775

$2.178

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

$2.223

10k+ parts

$2.176

100

$2.340

-

$2.223

$2.176

Parana Technologies

USA . 1,636 parts In-Stock

1+ parts

$9.200

100+ parts

-

1k+ parts

$9.843

10k+ parts

-

1,636

$9.200

-

$9.843

-

DigiPath Technology Company

USA . 2,028 parts In-Stock

1+ parts

$10.130

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

$10.130

-

-

-

ChromeModa Solutions

Germany . 1,769 parts In-Stock

1+ parts

$10.337

100+ parts

$8.476

1k+ parts

-

10k+ parts

-

1,769

$10.337

$8.476

-

-

IDEA Electronic Components Group

UK . 846 parts In-Stock

1+ parts

$10.337

100+ parts

$9.820

1k+ parts

$9.303

10k+ parts

-

846

$10.337

$9.820

$9.303

-

Lixinc

USA . 11,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,829

-

-

-

-

Overview

Discover the cutting-edge TUSB1210BRHBTQ1 by Texas Instruments, a top-tier manufacturer known for producing high-quality network interfaces. Ideal for various applications, this innovative product offers unmatched value to customers with its reliable performance and advanced features. Experience seamless connectivity with this versatile Ethernet transceiver, designed to meet industrial standards and ensure optimal operating temperatures. Upgrade your network systems with the TUSB1210BRHBTQ1 and unlock a world of possibilities in the realm of telecommunications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the network interface, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, making it convenient for electronics manufacturers.

Screening Level: AEC-Q100

This high screening level ensures that the network interface meets automotive electronic component requirements for quality and reliability.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

No. of Terminals: 32

Sufficient number of terminals for connecting to the circuit board and other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides thermal management and a compact design suitable for various electronic applications.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Ability to function in low temperatures, expanding the range of environmental conditions the network interface can be used in.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides corrosion resistance and ensures good electrical conductivity for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for secure mounting on the circuit board, reducing the risk of disconnection.

Maximum Seated Height: 1 mm

Low profile design makes it suitable for compact electronic devices.

Width: 5 mm

Compact width saves space on the circuit board, ideal for designs with limited space.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the soldering process, ensuring proper installation on the circuit board.

Length: 5 mm

Compact length allows for efficient use of space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in tough operating conditions.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with international safety and environmental regulations.

Telecom IC Type: ETHERNET TRANSCEIVER

Specifically designed for Ethernet communication, making it suitable for networking applications.

Nominal Supply Voltage: 3.6 V

Optimal supply voltage for efficient performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the circuit board, maximizing functionality in limited space.

Moisture Sensitivity Level (MSL): 2

Moisture-resistant design ensures durability in humid or damp environments.

Technical Specifications

Network Interfaces TUSB1210BRHBTQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TUSB1210BRHBTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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