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TUSB2E22YCGR

Texas Instruments

TUSB2E22YCGR by Texas Instruments

TUSB2E22YCGR by Texas Instruments is a network interface IC with 2 channels, operating at temperatures from -20 to 85°C. It features a grid array package style with very thin profile and fine pitch terminals. Ideal for telecom applications requiring an interface circuit with a nominal voltage of 1.8V.

Median Price

$3.967

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 121,198 parts In-Stock

1+ parts

$3.967

100+ parts

$3.234

1k+ parts

$2.156

10k+ parts

-

121,198

$3.967

$3.234

$2.156

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.156

100+ parts

-

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-

100

$2.156

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Digiode

USA . 1,562 parts In-Stock

1+ parts

$3.769

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1,562

$3.769

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Chip Stock

USA . 7,263 parts In-Stock

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7,263

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Vyrian

USA . 5,332 parts In-Stock

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5,332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,461 parts In-Stock

1+ parts

$2.156

100+ parts

-

1k+ parts

-

10k+ parts

$2.113

5,461

$2.156

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-

$2.113

Argo Parts USA

USA . 3,163 parts In-Stock

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$2.156

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3,163

$2.156

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Semicontronic

India . 121,148 parts In-Stock

1+ parts

$3.370

100+ parts

$3.286

1k+ parts

$3.269

10k+ parts

-

121,148

$3.370

$3.286

$3.269

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Ampacity Inc.

Singapore . 121,144 parts In-Stock

1+ parts

$3.370

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121,144

$3.370

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Corphita

USA . 4,632 parts In-Stock

1+ parts

$3.570

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4,632

$3.570

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Parana Technologies

USA . 1,998 parts In-Stock

1+ parts

$15.446

100+ parts

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1k+ parts

$15.827

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1,998

$15.446

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$15.827

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AZTECH Wire

Italy . 691 parts In-Stock

1+ parts

$16.670

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691

$16.670

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DigiPath Technology Company

USA . 1,903 parts In-Stock

1+ parts

$17.008

100+ parts

$15.647

1k+ parts

-

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1,903

$17.008

$15.647

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ChromeModa Solutions

Germany . 5,218 parts In-Stock

1+ parts

$17.355

100+ parts

$14.231

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5,218

$17.355

$14.231

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IDEA Electronic Components Group

UK . 1,457 parts In-Stock

1+ parts

$17.355

100+ parts

$16.487

1k+ parts

$15.620

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1,457

$17.355

$16.487

$15.620

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Lixinc

USA . 3,994 parts In-Stock

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3,994

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$2.113

1k+ parts

$2.048

10k+ parts

$2.005

100

-

$2.113

$2.048

$2.005

Overview

Enhance your network interfaces with the TUSB2E22YCGR by Texas Instruments, a high-quality product designed to deliver seamless connectivity and superior performance. With Texas Instruments' renowned expertise in manufacturing, this interface circuit offers reliable connections and optimized functionality for a wide range of applications. Whether you're looking to enhance your telecommunications systems or improve data transfer speeds, this product provides unmatched value, benefits, and advantages to meet your networking needs. Trust Texas Instruments for cutting-edge technology and unlock endless possibilities with the TUSB2E22YCGR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability for the network interface, ensuring a longer product lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during the manufacturing process.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the PCB and allowing for more components to be integrated.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this network interface can withstand temperature fluctuations and perform reliably even in harsh environments.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage helps in reducing power consumption and making the device more energy-efficient.

Technical Specifications

Network Interfaces TUSB2E22YCGR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B25

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

TUSB2E22YCGR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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