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TSL215

Texas Instruments

TSL215 by Texas Instruments

TSL215 by Texas Instruments is a 18.795 mm LINEAR OUTPUT PHOTO IC with min supply voltage of 4.5 V and max operating temp of 70°C. Ideal for DATA COMMUNICATION, it has a rectangular shape and can handle up to 0.003 A on-state current.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 6,888 parts In-Stock

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Digiode

USA . 440 parts In-Stock

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Freelance Electronics

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Parana Technologies

USA . 669 parts In-Stock

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$0.098

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$1.457

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669

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DigiPath Technology Company

USA . 988 parts In-Stock

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$0.108

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ChromeModa Solutions

Germany . 4,534 parts In-Stock

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$0.110

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$0.090

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IDEA Electronic Components Group

UK . 1,933 parts In-Stock

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$0.110

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$0.099

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AZTECH Wire

Italy . 769 parts In-Stock

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$7.497

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One Stop Electronics

USA . 135 parts In-Stock

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$11.100

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Corphita

USA . 4,110 parts In-Stock

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Kepictronics

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Overview

Enhance your data communication systems with the TSL215 by Texas Instruments, a high-quality linear output photo IC sensor designed for optimal performance. Manufactured by the industry leader Texas Instruments, this photo sensor offers unbeatable reliability and precision in a compact rectangular shape. With a minimum operating temperature of 0°C and a maximum operating temperature of 70°C, the TSL215 is perfect for a wide range of applications. Trust Texas Instruments to provide cutting-edge technology that delivers value, benefits, and advantages to your projects.

Feature Benefit Bullets

Configuration: COMPLEX

The complex configuration allows for more advanced functionalities and features, making this product suitable for high-performance applications.

Size: 18.795 mm

The compact size of the sensor makes it easy to integrate into various devices or systems without taking up too much space.

Optoelectronic Type: LINEAR OUTPUT PHOTO IC

The linear output allows for accurate and precise data communication, making this sensor ideal for applications where reliable data transmission is essential.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption, making this sensor suitable for applications where power efficiency is crucial.

Application: DATA COMMUNICATION

Designed specifically for data communication applications, this sensor delivers reliable and high-quality performance in transmitting data.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this sensor can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Shape: RECTANGULAR

The rectangular shape of the sensor allows for easy integration into various devices or systems, providing flexibility in design and installation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the sensor can function effectively even in cold environments, making it suitable for a variety of applications.

Maximum On State Current: 0.003 A

The low maximum on-state current ensures efficient power consumption and reduces heat generation, making this sensor suitable for applications where power efficiency is important.

Technical Specifications

Photo IC Sensors TSL215 attributes and parameters. Explore more Photo IC Sensors devices from Texas Instruments

Specs

Application:

DATA COMMUNICATION

Configuration:

COMPLEX

Infrared (IR) Range:

NO

No. of Functions:

1

Maximum On State Current:

.003 A

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optoelectronic Type:

Shape:

RECTANGULAR

Size:

18.795 mm

Minimum Supply Voltage:

4.5 V

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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