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TSL260

Texas Instruments

TSL260 by Texas Instruments

TSL260 by Texas Instruments is a 1.5mm linear output photo IC sensor with a single configuration. Operating b/w -25°C to 85°C, it has a min supply voltage of 3V and nominal voltage of 5V. Ideal for applications requiring IR detection, it features through-hole mounting and can handle up to 0.01A on-state current.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 28,500 parts In-Stock

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Vyrian

USA . 8,574 parts In-Stock

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Digiode

USA . 3,165 parts In-Stock

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Electronic Expediters

USA . 5 parts In-Stock

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Parana Technologies

USA . 2,004 parts In-Stock

1+ parts

$0.454

100+ parts

$42.152

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$0.409

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2,004

$0.454

$42.152

$0.409

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DigiPath Technology Company

USA . 1,301 parts In-Stock

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$0.500

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1,301

$0.500

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ChromeModa Solutions

Germany . 3,023 parts In-Stock

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$0.510

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$0.418

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$0.510

$0.418

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IDEA Electronic Components Group

UK . 2,086 parts In-Stock

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$0.510

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$0.459

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2,086

$0.510

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One Stop Electronics

USA . 1,015 parts In-Stock

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$1.100

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$1.100

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AZTECH Wire

Italy . 469 parts In-Stock

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$8.155

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469

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Corphita

USA . 3,222 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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Overview

Enhance your projects with the TSL260 Photo IC Sensor by Texas Instruments, a top-quality component that offers precise linear output for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust in the reliability and durability of this sensor. From robotics to security systems, this versatile sensor delivers value and accuracy, making it an essential tool for any electronics enthusiast or professional in need of high-performance optoelectronics. Experience the benefits of the TSL260 and take your projects to the next level.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration simplifies the setup process and reduces complexity, making it easy to use.

Size: 1.5 mm

Compact size allows for easy integration into various devices without taking up much space.

Optoelectronic Type: LINEAR OUTPUT PHOTO IC

Linear output allows for precise and accurate measurements, making it ideal for applications requiring high sensitivity.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in reducing power consumption and increasing efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environments.

Shape: RECTANGULAR

Rectangular shape provides ease of mounting and integration into various applications.

Minimum Operating Temperature: -25 °C

Wide range of minimum operating temperature makes it suitable for use in diverse environmental conditions.

Infrared (IR) Range: YES

Infrared range capability expands the range of applications this sensor can be used for, such as night vision or remote control systems.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with a wide range of devices.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides secure and stable installation in various devices.

Maximum On State Current: 0.01 A

Low maximum on state current consumption helps in reducing power usage and increasing overall efficiency.

Technical Specifications

Photo IC Sensors TSL260 attributes and parameters. Explore more Photo IC Sensors devices from Texas Instruments

Specs

Application:

GENERAL PURPOSE

Configuration:

SINGLE

Infrared (IR) Range:

YES

Mounting Feature:

No. of Functions:

1

Maximum On State Current:

.01 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Optoelectronic Type:

Shape:

RECTANGULAR

Size:

1.5 mm

Sub-Category:

Photo ICs

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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