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QSE158

Onsemi

QSE158 by Onsemi

QSE158 by Onsemi is a single configuration LOGIC OUTPUT PHOTO IC with 1.65mm size, operating from -40 to 85 °C. It has an IR range, 4-16V supply voltage, and 12mA max current. Ideal for applications requiring round shape optoelectronics with through hole mount feature.

Median Price

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Digiode

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ComSIT Distribution GmbH

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Elcom Components

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Metaverse IC Inc.

Canada . 29,530 parts In-Stock

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Problanco Electronics

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 6,807 parts In-Stock

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SupplyDigital Components

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Corphita

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TANS Electronics

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Kulean Microsystems

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UHIMA Technologies

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Overview

Discover the QSE158 by Onsemi, a top-quality single logic output photo IC sensor that offers unparalleled performance and reliability. Manufactured by industry leader Onsemi, this innovative sensor is ideal for a wide range of applications. From automotive to industrial automation, this round-shaped sensor with an infrared range delivers precise results in extreme temperatures. With a nominal hysteresis ratio of 1.1 and maximum operating temperature of 85 °C, the QSE158 provides exceptional value and benefits to customers looking for superior optoelectronic solutions. Elevate your projects with the QSE158 and experience the difference today.

Feature Benefit Bullets

Configuration: SINGLE

Having a single configuration simplifies the setup and operation of the sensor, making it user-friendly.

Size: 1.65 mm

Compact size allows for easy integration into various devices without taking up too much space.

Optoelectronic Type: LOGIC OUTPUT PHOTO IC

Logic output provides clear signals for easy interpretation, making it suitable for a wide range of applications.

Minimum Supply Voltage: 4 V

Low minimum supply voltage helps in energy efficiency and can operate in systems with lower power supply levels.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance even in challenging environments.

Shape: ROUND

Round shape allows for omnidirectional sensing, providing more comprehensive coverage.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables usage in cold environments without compromising performance.

Terminal Finish: Tin (Sn)

Tin terminal finish ensures good connectivity and reliability in various conditions.

Infrared (IR) Range: YES

Having an infrared range expands the sensor's capabilities, allowing it to detect a wider range of objects or signals.

Maximum Supply Current: 12 mA

Low maximum supply current helps in energy efficiency and reduces power consumption.

Nominal Hysteresis Ratio: 1.1

The nominal hysteresis ratio helps in providing stability and precise control in switching states.

Nominal Supply Voltage: 16 V

Having a nominal supply voltage of 16 V ensures compatibility with a wide range of systems and power supplies.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature makes installation and maintenance easier, providing a secure and stable connection.

Maximum On State Current: 0.05 A

Low maximum on-state current helps in reducing heat generation and improving overall efficiency.

Technical Specifications

Photo IC Sensors QSE158 attributes and parameters. Explore more Photo IC Sensors devices from Onsemi

Specs

Additional Features:

DAY LIGHT FILTER, HIGH SENSITIVITY, OPEN COLLECTOR, TTL COMPATIBLE

Application:

GENERAL PURPOSE

Configuration:

SINGLE

Nominal Hysteresis Ratio:

1.1

Infrared (IR) Range:

YES

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

1

Maximum On State Current:

.05 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Shape:

ROUND

Size:

1.65 mm

Sub-Category:

Photo ICs

Maximum Supply Current:

12 mA

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

16 V

Terminal Finish:

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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