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TSC2100IRHB

Texas Instruments

TSC2100IRHB by Texas Instruments

TSC2100IRHB by Texas Instruments is a 32-terminal IC with power supplies of 1.8V and 3.3V, suitable for consumer circuits in industrial applications. It features a package style of chip carrier, heat sink/slug, and very thin profile, with a temperature range from -40°C to 85°C. The IC utilizes CMOS technology and has a terminal pitch of 0.5mm for surface mount assembly.

Median Price

$8.642

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,714 parts In-Stock

1+ parts

$8.525

100+ parts

$6.950

1k+ parts

$4.633

10k+ parts

-

9,714

$8.525

$6.950

$4.633

-

Mouser Electronics

USA . 78 parts In-Stock

1+ parts

$11.870

100+ parts

$8.110

1k+ parts

$7.850

10k+ parts

$7.590

78

$11.870

$8.110

$7.850

$7.590

Rochester

USA . 890 parts In-Stock

1+ parts

-

100+ parts

$6.660

1k+ parts

$5.960

10k+ parts

$5.610

890

-

$6.660

$5.960

$5.610

DigiKey

USA . 890 parts In-Stock

1+ parts

-

100+ parts

$8.760

1k+ parts

-

10k+ parts

-

890

-

$8.760

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$5.791

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$5.791

-

-

-

Digiode

USA . 1,609 parts In-Stock

1+ parts

$6.108

100+ parts

-

1k+ parts

-

10k+ parts

-

1,609

$6.108

-

-

-

Vyrian

USA . 3,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,367

-

-

-

-

ComSIT Distribution GmbH

Germany . 73 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

73

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.494

100+ parts

$1.360

1k+ parts

$1.225

10k+ parts

-

100

$1.494

$1.360

$1.225

-

Parana Technologies

USA . 613 parts In-Stock

1+ parts

$1.574

100+ parts

-

1k+ parts

$2.212

10k+ parts

-

613

$1.574

-

$2.212

-

DigiPath Technology Company

USA . 1,773 parts In-Stock

1+ parts

$1.734

100+ parts

$1.595

1k+ parts

-

10k+ parts

-

1,773

$1.734

$1.595

-

-

ChromeModa Solutions

Germany . 2,664 parts In-Stock

1+ parts

$1.769

100+ parts

$1.451

1k+ parts

-

10k+ parts

-

2,664

$1.769

$1.451

-

-

IDEA Electronic Components Group

UK . 593 parts In-Stock

1+ parts

$1.769

100+ parts

-

1k+ parts

$1.592

10k+ parts

-

593

$1.769

-

$1.592

-

Ampacity Inc.

Singapore . 2,596 parts In-Stock

1+ parts

$5.470

100+ parts

-

1k+ parts

-

10k+ parts

-

2,596

$5.470

-

-

-

Corphita

USA . 3,328 parts In-Stock

1+ parts

$5.787

100+ parts

-

1k+ parts

-

10k+ parts

-

3,328

$5.787

-

-

-

Lixinc

USA . 9,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,492

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,596 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,596

-

-

-

-

Perfect Parts

USA . 259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

259

-

-

-

-

Kepictronics

USA . 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

68

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$5.675

1k+ parts

$5.502

10k+ parts

$5.386

50

-

$5.675

$5.502

$5.386

Overview

Elevate your consumer electronics with the TSC2100IRHB by Texas Instruments. Crafted with precision and expertise, this high-quality IC offers unparalleled performance and reliability. Whether you're designing cutting-edge wearables, smart home devices, or automotive applications, this versatile chip delivers exceptional value and efficiency. Trust in Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Choose the TSC2100IRHB for seamless integration and superior results in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost in manufacturing processes.

Package Shape: SQUARE

Optimal form factor for efficient use of space on the PCB, especially in applications where space is limited.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, ensuring compatibility and performance in everyday devices.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options, making it versatile and compatible with a wide range of devices.

No. of Terminals: 32

Provides flexibility in connecting to various components and interfaces, allowing for a more complex circuit design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers different package styles to choose from depending on specific application requirements, providing customization options.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, ensuring reliable performance even in challenging conditions.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable electrical connections.

Terminal Position: QUAD

Enables efficient and organized layout of terminals on the IC, improving ease of PCB design and assembly.

Maximum Seated Height: 1 mm

Low-profile design saves space on the PCB and allows for compact device design.

Width: 5 mm

Compact width allows for space-saving integration into small electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

Operates at low supply voltages, making it energy-efficient and suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during manufacturing processes, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes, ensuring proper soldering and reliability.

Length: 5 mm

Compact length allows for space-saving integration into small electronic devices.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous environmental and performance requirements of industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, suitable for a wide range of applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures reliability in electronic devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, ideal for compact electronic devices.

Moisture Sensitivity Level (MSL): 2

With MSL 2 rating, the IC is less sensitive to moisture during storage and assembly processes, improving reliability.

Maximum Supply Voltage (Vsup): 3.6 V

Supports higher supply voltages for broader compatibility with a variety of power sources.

Technical Specifications

Other Function Consumer ICs TSC2100IRHB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 1.525V TO 1.95V SUPPLY

General IC Type:

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TSC2100IRHB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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