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TSC2100IDAR

Texas Instruments

TSC2100IDAR by Texas Instruments

TSC2100IDAR by Texas Instruments is a consumer IC with 32 terminals, operating b/w -40 to 85°C. It has power supplies of 1.8V and 3.3V, suitable for industrial applications. This CMOS technology IC comes in a small outline package with a terminal pitch of 0.65mm, making it ideal for compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,854 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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9,854

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Digiode

USA . 3,882 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,882

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 793 parts In-Stock

1+ parts

$1.323

100+ parts

-

1k+ parts

$2.062

10k+ parts

-

793

$1.323

-

$2.062

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ChromeModa Solutions

Germany . 2,013 parts In-Stock

1+ parts

$1.486

100+ parts

$1.219

1k+ parts

-

10k+ parts

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2,013

$1.486

$1.219

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IDEA Electronic Components Group

UK . 1,885 parts In-Stock

1+ parts

$1.486

100+ parts

-

1k+ parts

$1.337

10k+ parts

-

1,885

$1.486

-

$1.337

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One Stop Electronics

USA . 1,622 parts In-Stock

1+ parts

$11.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,622

$11.800

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-

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AZTECH Wire

Italy . 335 parts In-Stock

1+ parts

$16.948

100+ parts

-

1k+ parts

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335

$16.948

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Corphita

USA . 2,712 parts In-Stock

1+ parts

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2,712

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DigiPath Technology Company

USA . 766 parts In-Stock

1+ parts

-

100+ parts

$1.340

1k+ parts

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10k+ parts

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766

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$1.340

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Microchip USA

USA . 320 parts In-Stock

1+ parts

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100+ parts

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320

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Overview

Enhance your consumer electronics with the TSC2100IDAR by Texas Instruments - a top-quality product designed to meet your needs. With a reputation for excellence, Texas Instruments delivers innovative solutions for various applications in the consumer IC category. The TSC2100IDAR offers exceptional value, benefits, and advantages for customers looking for reliable performance and durability. Upgrade your devices with this cutting-edge technology and experience the difference Texas Instruments can make in your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy installation on a circuit board, saving time and effort during manufacturing.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronics, this IC is optimized for efficiency and performance in everyday devices.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options, providing flexibility in design and compatibility with various systems.

No. of Terminals: 32

With a sufficient number of terminals, this IC can accommodate a range of input and output connections for versatile application.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Other Function Consumer ICs TSC2100IDAR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 1.525V TO 1.95V SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G32

Length:

11 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

TSC2100IDAR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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