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TSC2011IRTJT

Texas Instruments

TSC2011IRTJT by Texas Instruments

TSC2011IRTJT by Texas Instruments is a CMOS microcontroller with Nickel Palladium Gold terminal finish. It can withstand peak reflow temperature of 260°C for up to 30s. With MSL level 2, it's ideal for various applications requiring high-performance microcontrollers.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,466 parts In-Stock

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4,466

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Digiode

USA . 3,586 parts In-Stock

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3,586

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Bristol Electronics

USA . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$11.055

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-

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840

$11.055

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Parana Technologies

USA . 2,173 parts In-Stock

1+ parts

$14.447

100+ parts

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$14.888

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2,173

$14.447

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$14.888

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DigiPath Technology Company

USA . 384 parts In-Stock

1+ parts

$15.908

100+ parts

$14.636

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384

$15.908

$14.636

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One Stop Electronics

USA . 922 parts In-Stock

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$16.000

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922

$16.000

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IDEA Electronic Components Group

UK . 1,669 parts In-Stock

1+ parts

$16.233

100+ parts

$15.421

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$14.610

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1,669

$16.233

$15.421

$14.610

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ChromeModa Solutions

Germany . 1,174 parts In-Stock

1+ parts

$16.233

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$13.311

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1,174

$16.233

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Corphita

USA . 1,432 parts In-Stock

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1,432

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Overview

Unlock limitless possibilities with the TSC2011IRTJT by Texas Instruments, a powerhouse in the world of microcontrollers. Renowned for their superior quality and innovative technology, Texas Instruments delivers top-notch performance in a compact package. Perfect for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers seeking reliability, efficiency, and seamless functionality. Elevate your projects with the TSC2011IRTJT and experience the difference today!

Feature Benefit Bullets

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections and a long lifespan for the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short peak reflow time of 30 seconds helps prevent overheating of the microcontroller during assembly, reducing the risk of damage and ensuring optimal performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand high-temperature soldering processes, making it suitable for a variety of manufacturing environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product combines a central processing unit (CPU) with various peripherals on a single chip, providing a compact and efficient solution for embedded systems.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it energy-efficient and reliable for a wide range of applications.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring continued functionality and reliability in various operating conditions.

Technical Specifications

Microcontrollers TSC2011IRTJT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TSC2011IRTJT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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